NEO-M8P - Hardware Integration Manual
UBX-15028081 - R05
Early Production Information
Design
Page 11 of 27
No
Previous Name
New name
14
ANT_ON
LNA_EN
20
TxD
TXD /
SPI MISO
21
RxD
RXD /
SPI MOSI
Table 3: NEO-M8P Module Pin renaming
2.2
Minimal design
This is a minimal design for a NEO-M8P GNSS receiver.
Figure 4: NEO-M8P passive antenna design
2.3
Layout: Footprint and paste mask
Figure 5 describes the footprint and provides recommendations for the paste mask for NEO-M8P LCC modules.
These are recommendations only and not specifications. Note that the copper and solder masks have the same
size and position.
To improve the wetting of the half vias, reduce the amount of solder paste under the module and increase the
volume outside of the module by defining the dimensions of the paste mask to form a T-shape (or equivalent)
extending beyond the copper mask. For the stencil thickness, see section 3.2.
Consider the paste mask outline when defining the minimal distance to the next component. The exact
geometry, distances, stencil thicknesses and solder paste volumes must be adapted to the specific
production processes (e.g. soldering) of the customer.
