NEO-M8U - Hardware Integration Manual
UBX-15016700 - R07
Product handling
Page 19 of 28
Production Information
Repeated reflow soldering
Only single reflow soldering processes are recommended for boards populated with NEO-M8U
modules. The NEO-M8U module should not be submitted to two reflow cycles on a board populated
with components on both sides in order to avoid upside down orientation during the second reflow
cycle. In this case, the module should always be placed on that side of the board, which is submitted
into the last reflow cycle. The reason for this (besides others) is the risk of the module falling off due
to the significantly higher weight in relation to other components.
Two reflow cycles can be considered by excluding the above described upside down scenario and
taking into account the rework conditions described in section Product handling
.
☞
Repeated reflow soldering processes and soldering the module upside down are not
recommended.
Wave soldering
Base boards with combined through-hole technology (THT) components and surface-mount
technology (SMT) devices require wave soldering to solder the THT components. Only a single wave
soldering process is encouraged for boards populated with NEO-M8U modules.
Hand soldering
Hand soldering is allowed. Use a soldering iron temperature setting equivalent to 350 °C. Place the
module precisely on the pads. Start with a cross-diagonal fixture soldering (e.g. pins 1 and 15), and
then continue from left to right.
Rework
The NEO-M8U module can be unsoldered from the baseboard using a hot air gun. When using a hot
air gun for unsoldering the module, a maximum of one reflow cycle is allowed. In general, we do not
recommend using a hot air gun because this is an uncontrolled process and might damage the
module.
⚠
Attention: use of a hot air gun can lead to overheating and severely damage the module. Always
avoid overheating the module.
After the module is removed, clean the pads before placing and hand soldering a new module.
⚠
Never attempt a rework on the module itself, e.g. replacing individual components. Such actions
immediately terminate the warranty.
In addition to the two reflow cycles, manual rework on particular pins by using a soldering iron is
allowed. Manual rework steps on the module can be done several times.
Conformal coating
Certain applications employ a conformal coating of the PCB using HumiSeal
®
or other related coating
products. These materials affect the HF properties of the NEO-M8U module and it is important to
prevent them from flowing into the module. The RF shields do not provide 100% protection for the
module from coating liquids with low viscosity; therefore, care is required in applying the coating.
☞
Conformal Coating of the module will void the warranty.
Casting
If casting is required, use viscose or another type of silicon pottant. The OEM is strongly advised to
qualify such processes in combination with the NEO-M8U module before implementing this in the
production.
☞
Casting will void the warranty.
