NINA-B1 series - System Integration Manual
UBX-15026175 - R06
Handling and soldering
Page 37 of 48
4
Handling and soldering
No natural rubbers, hygroscopic materials or materials containing asbestos are employed.
4.1
Packaging, shipping, storage and moisture preconditioning
For information pertaining to reels, tapes or trays, moisture sensitivity levels (MSL), shipment and storage, as well
as drying for preconditioning refer to
NINA-B1 series Data Sheet [2]
and
u-blox Package Information Guide [1]
4.2
Handling
The NINA-B1 series modules are Electro-Static Discharge (ESD) sensitive devices and require special precautions
during handling. Particular care must be exercised when handling patch antennas, due to the risk of electrostatic
charges. In addition to standard ESD safety practices, the following measures should be taken into account
whenever handling the receiver:
•
Unless there is a galvanic coupling between the
local GND (i.e. the work table) and the PCB
GND, then the first point of contact when
handling the PCB must always be between the
local GND and PCB GND.
•
Before mounting an antenna patch, connect
ground of the device
•
When handling the RF pin, do not come into
contact with any charged capacitors and be
careful when contacting materials that can
develop charges (e.g. patch antenna ~10 pF,
coax cable ~50-80 pF/m, soldering iron, …)
•
To prevent electrostatic discharge through the
RF input, do not touch any exposed antenna
area. If there is any risk that such exposed
antenna area is touched in non ESD protected
work area, implement proper ESD protection
measures in the design.
•
When soldering RF connectors and patch
antennas to the receiver’s RF pin, make sure to
use an ESD safe soldering iron (tip).
4.3
Soldering
4.3.1
Reflow soldering process
The NINA-B1 series modules are surface mount modules supplied on a FR4-type PCB with gold plated
connection pads and produced in a lead-free process with a lead-free soldering paste. The bow and twist of the
PCB is maximum 0.75% according to IPC-A-610E. The thickness of solder resist between the host PCB top side
and the bottom side of the NINA-B1 series module must be considered for the soldering process.
The module is compatible with industrial reflow profile for RoHS solders. Use of "No Clean" soldering paste is
strongly recommended.
