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TUYA TYZS11 Manual Download Page 26

7 APPENDIX: STATEMENT

This product must not be disposed of as normal household waste, in accordance with

the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU).
Instead, it should be disposed of by returning it to the point of sale, or to a municipal
recycling collection point.

The device could be used with a separation distance of 20cm to the human body.

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Summary of Contents for TYZS11

Page 1: ...TYZS11 Module Datasheet Hardware Product Development Network Modules Zigbee Module TYZS Series Module Version 20210315 Online Version...

Page 2: ...4 Zigbee RX Power Consumption 11 3 5 Power Consumption in Operating Mode 11 4 RF Features 12 4 1 Basic RF Features 12 4 2 Zigbee Output Performance 12 4 3 Zigbee RX Sensitivity 13 5 Antenna Informati...

Page 3: ...ule developed by Hangzhou Tuya Information Technology Co Ltd It consists of a highly integrated wireless radio processor chip EFR32MG13P732 and several peripherals with a built in 802 15 4 PHY MAC Zig...

Page 4: ...s as required Figure 1 shows the architecture of TYZS11 Figure 1 TYZS11 architecture 1 1 Features Built in low power consuming 32 bit ARM Cortex M4 core with DSP instructions and oating point unit fun...

Page 5: ...hen TYZS11 is in the sleep state 1 4 uA Proactive network con guration for terminals Copper column antenna and onboard PCB antenna Working temperature 40 C to 85 C AES 128 256 based hardware encryptio...

Page 6: ...three rows of pins with a distance of 1 0 mm between every two pins TYZS11 dimension 15 3 mm W x 22 mm L x 2 mm H Figure 2 shows the overall pin layout of TYZS11 Figure 2 Front view of TYZS11 2 2 Pin...

Page 7: ...IC and functions as a GPIO 5 SWCLK I O JLINK SWCLK programming pin which can also be used as a GPIO in normal programs 6 SWDIO I O JLINK SWDIO programming pin which can also be used as a GPIO in norm...

Page 8: ...in of the IC and functions as a GPIO 14 UART_TXD O UART0_TXD communication interface corresponding to PA0 pin of the IC 15 UART_RXD I UART0_RXD communication interface corresponding to PA1 pin of the...

Page 9: ...n also be con gured as a GPIO 23 nRST I Hardware reset pin and the chip is reset when the level is low TYZS11 has a power on reset function and this pin is not necessary for the actual situation 24 GP...

Page 10: ...ch cannot clear the Zigbee network con guration This pin can only be used as the ADC interface and cannot be used as the common I O pin If this pin is not used it must be disconnected When this pin is...

Page 11: ...Unit Ts Storage temperature 50 150 C VCC Power supply voltage 0 3 3 8 V Static electricity voltage human model TAMB 25 C 2 5 kV Static electricity voltage machine model TAMB 25 C 0 5 kV 3 2 Electrica...

Page 12: ...VOH I O high level output VCC x 0 8 VCC V Imax I O drive current 12 mA 3 3 Zigbee TX Power Consumption Table 5 TX power consumption during constant emission Symbol Rate TX power Typical Value Unit IRF...

Page 13: ...eceived current is 14 mA 3 5 Power Consumption in Operating Mode Table 7 TYZS11 working current Working Mode Working Status Ta 25 C Average Value Maximum Value Unit EZ mode The module is in the EZ sta...

Page 14: ...rate 250 kbit s Antenna type External copper column spring antenna and onboard PCB antenna Line of sight transmission distance 120 m 4 2 Zigbee Output Performance Table 9 TX continuous transmission pe...

Page 15: ...r can reach 19 dBm The power output can be adjusted under normal use The high power output can be used for overlay trans mission in extremely complex conditions such as modules embedded in a wall 4 3...

Page 16: ...n conditions 5 2 Antenna Interference Reduction When you use a copper column antenna on a Zigbee module make sure that the antenna on the module is at least 15 mm away from other metal parts to ensure...

Page 17: ...6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6 Packaging information and production instructions 6 1 Mechanical Dimensions Figure 3 Mechanical dimensions of TYZS11 15 24...

Page 18: ...PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6 2 Recommended PCB Encapsulation Figure 4 TYZS11 schematic diagram and pin connection Comply with the encapsulation diagram provided in Figure 5 16 2...

Page 19: ...Instructions The stamp hole module must be mounted by the SMT machine After being unpacked it must be soldered within 24 hours Otherwise it must be put into the drying cupboard where the RH is not gre...

Page 20: ...n 90 The shelf life of a dry packaged product is 12 months from the date when the product is packaged and sealed The package contains a humidity indicator card HIC The module needs to be baked in the...

Page 21: ...older them Because these modules are 3 level moisture sensitive components they are very likely to get damp when exposed outside In this case if they are soldered at high temperatures it may result in...

Page 22: ...mperature 60 to 120s the range of constant tem perature 150 to 200 C F Duration above the liquidus 50 to 70s G Peak temperature 235 to 245 C H Ramp down slope 1 to 4 C s Note The above curve is just a...

Page 23: ...6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6 5 Storage conditions 21 24...

Page 24: ...ur in a particular installation If this device does cause harmful interference to radio or television reception which can be determined by turning the device o and on the user is encouraged to try to...

Page 25: ...duct must be labeled in a visible area with the following Contains Transmitter Module FCC ID 2ANDL TYZS11 This device is intended only for OEM integrators under the following conditions The antenna mu...

Page 26: ...ordance with the EU directive for waste electrical and electronic equipment WEEE 2012 19 EU Instead it should be disposed of by returning it to the point of sale or to a municipal recycling collection...

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