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PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
Figure 5 Encapsulation diagram of TYZS11
6.3 Production Instructions
• The stamp-hole module must be mounted by the SMT machine. After being
unpacked, it must be soldered within 24 hours. Otherwise, it must be put into
the drying cupboard where the RH is not greater than 10%, or it needs to be
packaged under vacuum again and the exposure time needs to be recorded
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