User's Manual l TQMa7x UM 0203 l © 2022, TQ-Systems GmbH
Page 44
4.4
Adaptation to the environment
The TQMa7x has overall dimensions (length × width) of 55 mm × 44 mm (± 0,1 mm).
The TQMa7x has a maximum height above the carrier board of approximately 8.8 mm.
The TQMa7x weighs approximately 17 g.
4.5
Protection against external effects
As an embedded module, the TQMa7x is not protected against dust, external impact and contact (IP00).
Adequate protection has to be guaranteed by the surrounding system.
4.6
Thermal management
To cool the TQMa7x, a maximum of approximately 7.2 W must be dissipated, see Table 48 for peak currents. The power
dissipation originates primarily in the CPU, the DDR3 SDRAM and the PMIC.
The power dissipation also depends on the software used and can vary according to the application.
For further information see PMIC Data Sheet (4) and chapter 3.2.7.2.
Attention: Malfunction or destruction, TQMa7x heat dissipation
The TQMa7x belongs to a performance category in which a cooling system is essential.
It is the user’s sole responsibility to define a suitable heat sink (weight and mounting position)
depending on the specific mode of operation (e.g., dependence on clock frequency, stack height,
airflow, and software). Particularly the tolerance chain (PCB thickness, board warpage, BGA balls, BGA
package, thermal pad, heatsink) as well as the maximum pressure on the i.MX7 must be taken into
consideration when connecting the heat sink, see (8).
The i.MX7 is not necessarily the highest component. Inadequate cooling connections can lead to
overheating of the TQMa7x and thus malfunction, deterioration or destruction.
4.7
Structural requirements
The TQMa7x is held in the mating plug connectors by the retention force of the 320 pins. For high requirements with respect to
vibration and shock firmness, an additional holder has to be provided in the final product to hold the TQMa7x in its position.
As no heavy and big components are assembled, no further requirements are given.
4.8
Notes of treatment
To avoid damage caused by mechanical stress, the TQMa7x may only be extracted from the carrier board by using the extraction
tool MOZI8XXL that can also be obtained separately.
Attention: Component placement on the carrier board
2.5 mm should be kept free on the carrier board, on both long sides of the TQMa7x
for the extraction tool MOZI8XXL.
