Preliminary User's Manual l TQMa8Xx UM 0002 l © 2018, TQ-Systems GmbH
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4.4
Adaptation to the environment
The TQMa8Xx has overall dimensions (length × width × height) of 55 × 44 × 8 mm3.
The TQMa8Xx has a maximum height above the carrier board of approximately 9.4 mm.
The TQMa8Xx weighs approximately 17 grams.
4.5
Protection against external effects
As an embedded module, the TQMa8Xx is not protected against dust, external impact and contact (IP00).
Adequate protection has to be guaranteed by the surrounding system.
4.6
Thermal management
To cool the TQMa8Xx, a calculated theoretical maximum of approximately 4.7 W have to be dissipated, see Table 11.
The cooling solution must be able to dissipate this power peak; it will never occur permanently in normal operation.
The power dissipation originates primarily in the i.MX 8X, the DDR3L SDRAM and the PMIC.
The power dissipation also depends on the software used and can vary according to the application.
See i.MX 8X Data Sheet (1) for further information.
Attention: Destruction or malfunction
The TQMa8Xx belongs to a performance category in which a cooling system is essential in most
applications. It is the user’s sole responsibility to define a suitable heat sink (weight and mounting
position) depending on the specific mode of operation (e.g., dependence on clock frequency, stack
height, airflow, and software). Particularly the tolerance chain (PCB thickness, board warpage, BGA
balls, BGA package, thermal pad, heatsink) as well as the maximum pressure on the i.MX 8X must be
taken into consideration when connecting the heat sink.
The i.MX 8X is not necessarily the highest component. Inadequate cooling connections can lead to
overheating of the TQMa8Xx and thus malfunction, deterioration or destruction.
4.7
Structural requirements
The TQMa8Xx is held in the mating connectors by the retention force of the pins (280). For high requirements with respect to
vibration and shock firmness, an additional holder has to be provided in the final product to hold the TQMa8Xx in its position.
4.8
Notes of treatment
To avoid damage caused by mechanical stress, the TQMa8Xx may only be extracted from the carrier board by using the
extraction tool MOZI8XXL that can also be obtained separately.
Attention: Note with respect to the component placement on the carrier board
2.5 mm should be kept free on the carrier board, on both long sides of the TQMa8Xx
for the extraction tool MOZI8XXL.
5.
SOFTWARE
The TQMa8Xx is delivered with a preinstalled boot loader U-Boot and a
, which is tailored for the MBa8Xx.
The boot loader U-Boot provides TQMa8Xx-specific as well as board-specific settings, e.g.:
•
i.MX 8X configuration
•
PMIC configuration
•
SDRAM configuration and timing
•
eMMC configuration
•
Multiplexing
•
Clocks
•
Pin configuration
•
Driver strengths
These settings have to be adapted, in case another bootloader is used.
More information can be found in the
