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TPM
SPC-3000 User Manual
11
1.2. Features
1.2.1. Fan-less Design
SPC-3000 Series are all fan-less design. Hence, the size of SPC-3000 is form factor. The dimension is
smaller than any other embedded system. It is suitable for different environment.
With fan-less design, the design of Heat Sink is important. The CPU and Heat Sink can directly contact
together with thermal grease to increase the efficiency of thermal conductivity.
Figure 1-6: Thermal conductivity
The surface area with curved shape increased about 50% will lead to high efficiency of dissipating.
Figure 1-7: Heat dissipation
Thermal grease
CPU
Heat sink