TPS856
2007-10-01
6
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Second reflow soldering
In case of second reflow soldering, it should be performed within 168 h after first reflow under the
above conditions.
Storage conditions before second reflow soldering: 30°C, 70% RH or lower
•
Do not perform flow soldering.
•
Make any necessary soldering correction manually.
(Do not do this more than once for any given pin.)
Temperature: no more than 350°C (25 W for soldering iron)
Time: within 5 s
(2) Recommended soldering pattern
(3)
Cleaning conditions
When cleaning is required after soldering
Chemicals: AK225 alcohol
Temperature and time: 50°C
×
30 s or 30°C
×
3 min
Ultrasonic cleaning: 300 W or less
Packing Specification
(1)
Packing quantity
Reel (minimum packing quantity)
3,000 devices
Carton
5 reels (15,000 devices)
(2)
Packing format
Silica gel and reel are packed into sealed aluminum envelope.
Pack shock-absorbent materials around the aluminum envelopes in the cartons to cushion them.
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Carton specification
Carton
dimensions
(W) 81 mm
×
(L) 280 mm
×
(H) 280 mm
Unit: mm
0.5
1.35
0.5
0.3
0.45
1.0
Label
