20070312
1-21-1
E3B90EL
ELECTRICAL PARTS LIST
PRODUCT SAFETY NOTE:
Products marked with a
!
have special characteristics important to safety.
Before replacing any of these components, read
carefully the product safety notice in this service
manual. Don't degrade the safety of the product
through improper servicing.
NOTES:
1. Parts that are not assigned part numbers (---------)
are not available.
2. Tolerance of Capacitors and Resistors are noted
with the following symbols.
Comparison Chart of Models and Marks
DVD MECHANISM & DVD/HDD MAIN
BOARD ASSEMBLY
POWER ASSEMBLY
BOARD POWER
C.....±0.25%
D.....±0.5%
F.....±1%
G.....±2%
J......±5%
K.....±10%
M.....±20%
N.....±30%
Z.....+80/-20%
Model
Mark
RD-XV47-K-TE
A
RD-XV47-K-TB
B
RD-XV47-K-TF
C
!
Loca-
tion No.
Mark
TSB P/N
Reference No.
Description
!
P2
A
P000483840 N78EJCEN
DVD MECHANISM & DVD/
HDD MAIN BOARD
ASSEMBLY
!
P2
B
P000484060 N78EKCBN
DVD MECHANISM & DVD/
HDD MAIN BOARD
ASSEMBLY
!
P2
C
P000484140 N78ELCFN
DVD MECHANISM & DVD/
HDD MAIN BOARD
ASSEMBLY
!
Loca-
tion No.
Mark
TSB P/N
Reference No.
Description
!
P1
A
P000483770 1VSA15687
POWER ASSEMBLY
!
P1
B
P000484010 1VSA15558
POWER ASSEMBLY
!
P1
C
P000484130 1VSA15689
POWER ASSEMBLY
Consists of the following:
----------
----------
BOARD POWER (BOARD
POWER A)
----------
----------
BOARD POWER SWITCH
(BOARD POWER B)
P4
P000472720 1VSA13519
BOARD SENSOR
!
Loca-
tion No.
Mark
TSB P/N
Reference No.
Description
----------
BOARD POWER (BOARD
POWER A)
Consists of the following:
CAPACITORS
C251
CE1CMAVSL100 ELECTROLYTIC CAP.
10
μ
F/16V M H7
C252
CHD1JZ30F104
CHIP CERAMIC
CAP.(1608) F Z 0.1
μ
F/50V
C253
CHD1JK30B102
CHIP CERAMIC
CAP.(1608) B K 1000pF/
50V
C254
CE1JMAVSL1R0 ELECTROLYTIC CAP. 1
μ
F/
50V M H7
C301
CHD1JK30B223
CHIP CERAMIC
CAP.(1608) B K 0.022
μ
F/
50V
C302
CE1JMAVSL1R0 ELECTROLYTIC CAP. 1
μ
F/
50V M H7
C303
CHD1JZ30F104
CHIP CERAMIC
CAP.(1608) F Z 0.1
μ
F/50V
C305
CE1JMAVSL1R0 ELECTROLYTIC CAP. 1
μ
F/
50V M H7
C306
CHD1JK30B473
CHIP CERAMIC
CAP.(1608) B K 0.047
μ
F/
50V
C307
CHD1JK30B223
CHIP CERAMIC
CAP.(1608) B K 0.022
μ
F/
50V
C308
CHD1JZ30F104
CHIP CERAMIC
CAP.(1608) F Z 0.1
μ
F/50V
C311
CHD1JZ30F104
CHIP CERAMIC
CAP.(1608) F Z 0.1
μ
F/50V
C312
CE1CMAVSL100 ELECTROLYTIC CAP.
10
μ
F/16V M H7
C313
CE1JMAVSL1R0 ELECTROLYTIC CAP. 1
μ
F/
50V M H7
C314
CHD1JK30B103
CHIP CERAMIC
CAP.(1608) B K 0.01
μ
F/
50V
C315
CHD1JK30B473
CHIP CERAMIC
CAP.(1608) B K 0.047
μ
F/
50V
C316
CE1JMAVSL1R0 ELECTROLYTIC CAP. 1
μ
F/
50V M H7
C317
CHD1JZ30F104
CHIP CERAMIC
CAP.(1608) F Z 0.1
μ
F/50V
C318
A
CHD1JK30B223
CHIP CERAMIC
CAP.(1608) B K 0.022
μ
F/
50V
C324
CHD1JK30B103
CHIP CERAMIC
CAP.(1608) B K 0.01
μ
F/
50V
C325
CHD1JK30B822
CHIP CERAMIC CAP. B K
8200pF/50V
C326
CHD1JZ30F104
CHIP CERAMIC
CAP.(1608) F Z 0.1
μ
F/50V
C328
CE0KMAVSL470 ELECTROLYTIC CAP.
47
μ
F/6.3V M H7
C329
CHD1JZ30F104
CHIP CERAMIC
CAP.(1608) F Z 0.1
μ
F/50V
C331
CE0KMAVSL221 ELECTROLYTIC CAP.
220
μ
F/6.3V M H7
C332
CE1CMAVSL101 ELECTROLYTIC CAP.
100
μ
F/16V M H7
C333
CHD1JZ30F104
CHIP CERAMIC
CAP.(1608) F Z 0.1
μ
F/50V
C334
CE1JMAVSL1R0 ELECTROLYTIC CAP. 1
μ
F/
50V M H7
C335
CE0KMAVSL101 ELECTROLYTIC CAP.
100
μ
F/6.3V H7
C336
CHD1JJ3CH221
CHIP CERAMIC CAP. CH J
220pF/50V
C337
CHD1JZ30F104
CHIP CERAMIC
CAP.(1608) F Z 0.1
μ
F/50V
C339
CHD1JJ3CH121
CHIP CERAMIC CAP. CH J
120pF/50V
C340
CE1JMAVSL1R0 ELECTROLYTIC CAP. 1
μ
F/
50V M H7
C341
CHD1JD3CH100 CHIP CERAMIC
CAP.(1608) CH D 10pF/
50V
C342
CHD1JJ3CH102
CHIP CERAMIC
CAP.(1608) CH J 1000pF/
50V
C343
CE1CMAVSL100 ELECTROLYTIC CAP.
10
μ
F/16V M H7
C344
CP1EMAVSB4R7 ELECTROLYTIC CAP.
4.7
μ
F/25V M NP H7
C345
CE1JMAVSLR47 ELECTROLYTIC CAP.
0.47
μ
F/50V M H7
!
Loca-
tion No.
Mark
TSB P/N
Reference No.
Description