(*1)
GREEN PRODUCT PROCUREMENT
The EC is actively promoting the WEEE & RoHS Directives that define standards for recycling
and reuse of Waste Electrical and Electronic Equipment and for the Restriction of the use of
certain Hazardous Substances. From July 1, 2006, the RoHS Directive will prohibit any marketing
of new products containing the restricted substances.
Increasing attention is given to issues related to the global environmental. Toshiba Corporation
recognizes environmental protection as a key management tasks, and is doing its utmost to
enhance and improve the quality and scope of its environmental activities. In line with this,
Toshiba proactively promotes Green Procurement, and seeks to purchase and use products,
parts and materials that have low environmental impacts.
Green procurement of parts is not only confined to manufacture. The same green parts used in
manufacture must also be used as replacement parts.
(*2)
LEAD-FREE SOLDER
This product is manufactured using lead-free solder as a part of a movement within the consumer
products industry at large to be environmentally responsible. Lead-free solder must be used in the
servicing and repair of this product.
WARNING
This product is manufactured using lead free solder.
DO NOT USE LEAD BASED SOLDER TO REPAIR THIS PRODUCT !
The melting temperature of lead-free solder is higher than that of leaded solder by 86°F to 104°F
(30°C to 40°C). Use of a soldering iron designed for lead-based solders to repair product made
with lead-free solder may result in damage to the component and or PCB being soldered. Great
care should be made to ensure high-quality soldering when servicing this product especially when
soldering large components, through-hole pins, and on PCBs as the level of heat required to melt
lead-free solder is high.
Summary of Contents for HD-A1SN
Page 18: ... C121 Fig 1 4 2 Digital Unit Bottom Side ...
Page 40: ...Fig 3 4 1 4 CIRCUIT DIAGRAMS 4 1 Power Supply Circuit Diagram ...
Page 41: ...4 2 Front Circuit Diagram 4 2 1 PWR SW Circuit Diagram Fig 3 4 2 ...
Page 42: ...4 2 2 USB Circuit Diagram Fig 3 4 3 ...
Page 43: ...Fig 3 4 4 4 2 3 Front MAIN Circuit Diagram ...
Page 44: ...4 2 4 Door Detect Circuit Diagram HD XA1 Fig 3 4 5 ...
Page 45: ...4 2 5 Motor Circuit Diagram HD XA1 Fig 3 4 6 ...
Page 46: ...Fig 3 4 7 4 3 AV Circuit Diagram 4 3 1 Audio Circuit Diagram ...
Page 47: ...4 3 2 Video Circuit Diagram Fig 3 4 8 ...
Page 48: ...4 3 3 HDMI Circuit Diagram Fig 3 4 9 ...
Page 50: ...1 2 3 4 5 6 7 8 A B Fig 3 5 2 Front MAIN PC Board Bottom side ...
Page 53: ...5 6 AV PC Board Fig 3 5 11 AV PC Board Top side 1 2 3 4 5 6 7 A B C ...
Page 54: ...Fig 3 5 12 AV PC Board Bottom side 1 2 3 4 5 6 7 A B C ...
Page 56: ...1 EXPLODED VIEWS 1 1 Packing Assembly Fig 4 1 1 Z006 Z001 Z009 Z010 Z013 Z002 Z007 ...
Page 68: ...1 1 SHIBAURA 1 CHOME MINATO KU TOKYO 105 8001 JAPAN ...