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Copyright © 2015 TOSHIBA TELI CORPORATION, All rights reserved.
Doc. No. 4300-0223
Incident light
Incident light
On-chip lens
Color filter
Wiring layer
Light receiving
surface
Photo diode
Photo diode
Light receiving
surface
Wiring layer
Surface
irradiation type
Back-side
irradiation type
Advantage of BU1203MC/MCF
Structure difference between surface irradiation type sensor
(conventional) and back side irradiation type sensor
Incident light is hindered and reduced
by wiring layer before it reaches photo
diode. As a result, sensitivity is reduced.
Setting photo diode on front surface,
then setting color filter and micro lens
on it. As a result, sensitivity is well kept
without hindrance of wiring layer.
2015/12/25
