- 2 -
TABLE OF CONTENTS
SERVICE INSTRUCTIONS ................................................................................................................................................. 3
HANDLING THE LCD MODULE .......................................................................................................................................... 5
SERVICE MODE .................................................................................................................................................................. 7
LOCATION OF CONTROLS ............................................................................................................................................... 12
LAYOUT OF MAJOR BOARDS .......................................................................................................................................... 15
MECHANICAL DISASSEMBLY .......................................................................................................................................... 16
EXPLODED VIEW .............................................................................................................................................................. 18
PACKING DISASSEMBLY ................................................................................................................................................. 20
CHASSIS AND CABINET REPLACEMENT PARTS LIST ................................................................................................. 21
PC BOARDS TOP & BOTTOM VIEW ................................................................................................................................ 31
CIRCUIT BLOCK DIAGRAM .............................................................................................................................................. 49
SPECIFICATIONS ............................................................................................................................................................. 51
APPENDIX:
SCHEMATIC DIAGRAM
(*1)
GREEN PRODUCT PROCUREMENT
The EC is actively promoting the WEEE & RoHS Directives that define standards for recycling and
reuse of Waste Electrical and Electronic Equipment and for the Restriction of the use of certain
Hazardous Substances. From July 1, 2006, the RoHS Directive will prohibit any
marketing of new products containing the restricted substances.
Increasing attention is given to issues related to the global environmental. Toshiba Corporation
recognizes environmental protection as a key management tasks, and is doing its utmost to enhance
and improve the quality and scope of its environmental activities. In line with this,
Toshiba proactively promotes Green Procurement, and seeks to purchase and use products,
parts and materials that have low environmental impacts.
Green procurement of parts is not only confined to manufacture. The same green parts used in
manufacture must also be used as replacement parts.
(*2)
LEAD-FREE SOLDER
This product is manufactured using lead-free solder as a part of a movement within the consumer
products industry at large to be environmentally responsible. Lead-free solder must be used in
the servicing and repair of this product.
WARNING
This product is manufactured using lead free solder.
DO NOT USE LEAD BASED SOLDER TO REPAIR THIS PRODUCT !
The melting temperature of lead-free solder is higher than that of leaded solder by 86
°
F to
104
°
F (30
°
C to 40
°
C). Use of a soldering iron designed for lead-based solders to repair product
made with lead-free solder may result in damage to the component and or PCB being soldered.
Great care should be made to ensure high-quality soldering when servicing this product
especially when soldering large components, through-hole pins, and on PCBs
as the level
of heat required to melt lead-free solder is high.
