GREEN PRODUCT PROCUREMENT
(*1)
The EC is actively promoting the WEEE & RoHS Directives that define standards
for recycling and reuse of Waste Electrical and Electronic Equipment and for the
Restriction of the use of certain Hazardous Substances. From July 1, 2006, the
RoHS Directive will prohibit any marketing of new products containing the
restricted substances.
Increasing attention is given to issues related to the global environmental.
Toshiba Corporation recognizes environmental protection as a key management
tasks, and is doing its utmost to enhance and improve the quality and scope of its
environmental activities. In line with this, Toshiba proactively promotes Green
Procurement, and seeks to purchase and use products, parts and materials that
have low environmental impacts.
Green procurement of parts is not only confined to manufacture. The same green
parts used in manufacture must also be used as replacement parts.
LEAD-FREE SOLDER
(*2)
This product is manufactured using lead-free solder as a part of a movement
within the consumer products industry at large to be environmentally responsible.
Lead-free solder must be used in the servicing and repair of this product.
WARNING
This product is manufactured using lead free solder.
DO NOT USE LEAD BASED SOLDER TO REPAIR THIS PRODUCT !
The melting temperature of lead-free solder is higher than that of leaded solder
by 86°F to 104°F (30°C to 40°C). Use of a soldering iron designed for lead-based
solders to repair product made with lead-free solder may result in damage to the
component and or PCB being soldered. Great care should be made to ensure
high-quality soldering when servicing this product — especially when soldering
large components, through-hole pins, and on PCBs — as the level of heat
required to melt lead-free solder is high.
Summary of Contents for 15DV703R
Page 1: ...FILE No 810 201090GR ...
Page 2: ......
Page 3: ...R ...
Page 4: ......
Page 48: ... ˈ ˉ ˆ ˊ ˇ ˆ ˈ ˋ ˊ ˈ ˉ ˌ ˇ 15DV703R ˆ ˉ ˇ 5 Expladed Diagram 45 ...
Page 50: ...47 19DV703R ˌ ˇ ˆ ˋ ˋ ˉ ˆ ˌ ˊ ˊ ˈ ˆ ˊ ˉ ˈ ˉ ˇ ˈ ...
Page 52: ...4 19DV704R ˆ ˇ ˆ ˆˇ ˊ ˋ ˋ ˌ ˉ ˆ ˉ ˆ ˌ ˊ ˋ ˊ ˇ ˈ ˈ ˌ ...
Page 54: ...49 ˈ ˇ ˈ ˉ ˉ ˋ ˌ ˊ ˉ ˆ ˌ ˊ ˇ ˊ ˆ ˈ ˋ ˇ 22DV703R ...
Page 56: ...50 ˈ ˆ ˉ ˆ ˊ ˆˇ ˊ ˊ ˋ ˌ ˇ ˆ ˈ ˋ ˌ ˋ ˊ ˈ ˉ ˌ ˇ 22DV704R ...
Page 58: ...51 ˈ ˆ ˉ ˆ ˊ ˆ ˋ ˌ ˇ ˆ ˈ ˋ ˋ ˊ ˈ ˉ ˌ ˇ 26DV703R ˆ ˆ ˉ ˇ ˌ ˇ ...
Page 60: ...53 ˈ ˆ ˉ ˆ ˊ ˆ ˊ ˋ ˌ ˇ ˆ ˈ ˋ ˋ ˊ ˈ ˉ ˌ ˇ 32DV703R ˌ ˆ ˉ ˇ ...
Page 62: ...55 6 Packing Diagrams 15DV703R ...
Page 63: ...56 19DV703R 19DV704R ...
Page 64: ...57 22DV703R 22DV704R ...
Page 65: ...58 26DV703R ...
Page 66: ...59 32DV703R ...
Page 68: ...61 DVD Module ...
Page 71: ...64 8 Printed Circuit Board Top Trace ...
Page 72: ...65 Top Component ...
Page 73: ...66 Bottom Trace ...
Page 74: ...67 Bottom Component ...
Page 93: ......