Texas Instruments WL1837MODCOM8I User Manual Download Page 9

EDGE CONNECTOR - MALE

ANT2 - WL_2.4_IO1/WL_5GHz

ANT1 - WL_2.4_IO2/BT/WL_5GHz

R20 for test mode.

These two TPs for test mode
when WL_IRQ pull high.

WL_UART_DBG

BT_AUD_CLK

BT_AUD_FSYNC

BT_AUD_IN

WL_RS232_TX

WL_RS232_RX

BT_HCI_TX

BT_HCI_RX

BT_HCI_CTS

BT_HCI_RTS

BT_EN_SOC

BT_UART_DBG

SDIO_CLK_WL

SDIO_CMD_WL

SDIO_D0_WL

SDIO_D2_WL

SDIO_D3_WL

SDIO_D1_WL

WLAN_EN_SOC

BT_AUD_OUT

BT_FUNC1

GPIO9

GPIO11

GPIO12

GPIO10

SLOW_CLK

BT_FUNC2

WLAN_IRQ

RF_ANT1

RF_ANT2

SDIO_D3_WL

GPIO12

SDIO_D2_WL

GPIO11

SDIO_D0_WL

SDIO_D1_WL

GPIO9

WLAN_IRQ

GPIO10

RF_ANT2

WL_RS232_TX

WL_RS232_RX

RF_ANT1

BT_FUNC1

BT_FUNC2

BT_HCI_RX

BT_HCI_TX

BT_HCI_CTS

BT_HCI_RTS

BT_AUD_IN

BT_AUD_OUT

BT_AUD_CLK

BT_AUD_FSYNC

SDIO_CMD_WL

SDIO_CLK_WL

SLOW_CLK

WL_UART_DBG

BT_UART_DBG

BT_EN_SOC

WLAN_EN_SOC

EXT_CLK_REQ_OUT

EXT_CLK_REQ_OUT

TCXO_CLK_COM

TCXO_CLK_COM

VBAT_IN

VIO_IN

VIO_IN

VBAT_IN

VIO_IN

VIO_IN

VBAT_IN

VIO_CLK

VIO_CLK

R20

10k

0402

L3
2.2nH

0402

R25

0R

0402

C5
0R

0402

J6
U.FL-R-SMT(10)

U.FL

1

2

3

TCXO1
NU_TCXO 26MHz

2.0x1.6x0.73mm

NC

1

VCC

4

OUT

3

GND

2

R17

0R

0402

C6
0R

0402

R31
0R

0603

J2
NU_100pin Micro Edge MEC6

SD-100P

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

65

66

67

68

69

70

71

72

73

74

75

76

77

78

79

80

81

82

83

84

85

86

87

88

89

90

91

92

93

94

95

96

97

98

99

100

ANT1
W3006

ANT-10.0X3.2MM_B

FEED

1

NC

2

R33
0R

0402

TP4

1

C7

NU_0R

0402

U4
NU_TLV70518

XBGA-N4_0.8X0.8_0.4

VIN

B2

VOUT

B1

EN

A2

GND

A1

R12

0R

0402

R11

0R

0402

R34
NU

0402

C1
1uF

0402

R30

0R

0402

R9

0R

0402

J5
U.FL-R-SMT(10)

U.FL

1

2

3

L2
NU

0402

R10

0R

0402

TP1

1

TP5

1

R2

0R

0402

L1
1.3nH

0402

0R

R21

0402

0R

R19

0402

OSC1
1V8 / 32.768kHz

OSC-3.2X2.5

EN

1

VCC

4

OUT

3

GND

2

R6
0R

0402

C32
NU_0.1uF

0402

R3

0R

0402

R16

0R

0402

U1
WL1837MODGJ

E-13.4X13.3-N100_0.75-TOP

GND

17

V

IO

3

8

V

B

A

T

4

7

E

X

T

_32K

36

BT_AUD_FSYNC

58

BT_AUD_IN

56

BT_AUD_OUT

57

BT_AUD_CLK

60

W

L

_

S

D

IO

_

D

2

1

2

W

L

_

S

D

IO

_

C

L

K

8

W

L

_

S

D

IO

_

D

3

1

3

W

L

_

S

D

IO

_

D

0

1

0

W

L

_

S

D

IO

_

D

1

1

1

W

L

_

S

D

IO

_

C

M

D

6

BT_HCI_RTS

50

BT_HCI_RX

53

BT_HCI_TX

52

BT_HCI_CTS

51

GN

D

1

6

GPIO_4

25

GPIO_2

26

GPIO_1

27

B

T

_

E

N

_

S

O

C

4

1

W

L

A

N

_

IR

Q

1

4

W

L

A

N

_

E

N

_

S

O

C

4

0

B

T

_

U

A

R

T

_

D

B

G

4

3

W

L

_

U

A

R

T

_

D

B

G

4

2

GND

G13

GND

G14

GND

G15

GND

G16

GND

G9

GND

G10

GN

D

4

8

GND

G11

GND

G12

V

B

A

T

4

6

GND

28

GND

G1

GND

G2

GND

G3

GND

G4

GND

G5

GND

G6

GND

G7

GND

G8

RF_ANT1

32

RESERVED

64

GN

D

1

GND

20

RESERVED1

21

RESERVED2

22

GN

D

3

7

GND

19

RESERVED3

62

GND

G17

GND

G18

GND

G19

GND

G20

GND

G21

GND

G22

GND

G23

GND

G24

GND

G25

GND

G26

GND

G27

GND

G28

GND

G29

GND

G30

GND

G31

GND

G32

GND

G33

GND

G34

GND

G35

GND

23

GND

59

GN

D

3

4

GND

29

GN

D

7

RF_ANT2

18

GND

49

GN

D

9

GND

31

GN

D

3

5

GN

D

1

5

GND

55

GN

D

4

5

GN

D

4

4

GND

30

GND

24

GND

63

GND

61

GN

D

3

9

GN

D

3

3

GND

54

GND

G36

G

P

IO

1

1

2

G

P

IO

9

3

G

P

IO

1

0

4

G

P

IO

1

2

5

R35
NU

0402

C2
10uF

0603

R32
0R

0603

J1
NU_HEADER 1x2

H-1X2_2MM

1

2

R1

0R

0402

R29

0R

0402

R8

0R

0402

TP7

1

C13
0.9pF

0402

TP6

1

TP3

1

R28

0R

0402

0R

R24

0402

R7

0R

0402

R14

0R

0402

C8

NU_0R

0402

C4
0.1uF

0402

R27

0R

0402

R13

0R

0402

R15

0R

0402

C3
0.1uF

0402

0R

R22

0402

R18

0R

0402

R4

0R

0402

R23

0R

0402

C15
NU_1uF

0402

ANT2
W3006

ANT-10.0X3.2MM_A

FEED

1

NC

2

C14
1.5pF

0402

R5

NU

0402

J3
NU_HEADER 1x2

H-1X2_2MM

1

2

L4
3.9nH

0402

R36

NU

0402

TP8

1

0R

R26

0402

TP2

1

www.ti.com

Antenna Characteristics

4.3

Radio Pattern

For information on the antenna radio pattern and other related information, see

productfinder.pulseeng.com/product/W3006

.

5

Circuit Design

5.1

EVB Reference Schematics

Figure 6

shows the reference schematics for the EVB.

Figure 6. EVB Reference Schematics

9

SWRU382 – November 2014

WL1837MODCOM8I WLAN MIMO and Bluetooth

®

Module Evaluation Board

for TI Sitara™ Platform

Submit Documentation Feedback

Copyright © 2014, Texas Instruments Incorporated

Summary of Contents for WL1837MODCOM8I

Page 1: ...ections 7 3 Electrical Characteristics 7 4 Antenna Characteristics 8 4 1 VSWR 8 4 2 Efficiency 8 4 3 Radio Pattern 9 5 Circuit Design 9 5 1 EVB Reference Schematics 9 5 2 Bill of Materials BOM 10 6 Layout Guidelines 11 6 1 Board Layout 11 7 Ordering Information 16 List of Figures 1 WL1837MODCOM8I EVB Top View 3 2 EVB Top View 4 3 EVB Bottom View 5 4 Antenna VSWR Characteristics 8 5 Antenna Efficie...

Page 2: ...ttom Layer Antenna and RF Trace Routing Layout Guidelines 15 17 MIMO Antenna Spacing 16 List of Tables 1 Pin Description 5 2 BOM 10 3 Module Layout Guidelines 13 4 Antenna and RF Trace Routing Layout Guidelines 15 2 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board SWRU382 November 2014 for TI Sitara Platform Submit Documentation Feedback Copyright 2014 Texas Instruments Incorporated ...

Page 3: ...ice Shared host controller interface HCI transport for Bluetooth BLE and ANT using UART and SDIO for WLAN Wi Fi and Bluetooth single antenna coexistence Built in chip antenna Optional U FL RF connector for external antenna Direct connection to the battery using an external switched mode power supply SMPS supporting 2 9 to 4 8 V operation VIO in the 1 8 V domain 1 2 Key Benefits The WL1837MOD offer...

Page 4: ...ce is designed for the following applications Portable consumer devices Home electronics Home appliances and white goods Industrial and home automation Smart gateway and metering Video conferencing Video camera and security 2 Board Pin Assignment Figure 2 shows the top view of the EVB Figure 2 EVB Top View 4 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board SWRU382 November 2014 for T...

Page 5: ...7 VBAT P 3 6 V typical voltage input 8 VIO P VIO 1 8 V I O voltage input 9 GND G Ground 10 N C No connection 11 WL_RS232_TX O WLAN tool RS232 output 12 N C No connection 13 WL_RS232_RX I WLAN tool RS232 input 14 N C No connection 15 WL_UART_DBG O WLAN Logger output 16 N C No connection 17 N C No connection 18 GND G Ground 19 GND G Ground 20 SDIO_CLK I WLAN SDIO clock 5 SWRU382 November 2014 WL1837...

Page 6: ... C No connection 44 N C No connection 45 N C No connection 46 N C No connection 47 GND G Ground 48 N C No connection 49 N C No connection 50 N C No connection 51 N C No connection 52 PCM_IF_CLK I O Bluetooth PCM clock input or output 53 N C No connection 54 PCM_IF_FSYNC I O Bluetooth PCM frame sync input or output 55 N C No connection 56 PCM_IF_DIN I Bluetooth PCM data input 57 N C No connection 5...

Page 7: ... No connection 91 N C No connection 92 GND G Ground 93 RESERVED2 I Reserved 94 N C No connection 95 GND G Ground 96 GPIO11 I O General purpose I O 97 GND G Ground 98 GPIO12 I O General purpose I O 99 TCXO_CLK_COM Option to supply 26 MHz externally 100 GPIO10 I O General purpose I O 2 2 Jumper Connections The WL1837MODCOM8I EVB includes the following jumper connections J1 Jumper connector for VIO p...

Page 8: ...ristics Figure 4 Antenna VSWR Characteristics 4 2 Efficiency Figure 5 shows the antenna efficiency Figure 5 Antenna Efficiency 8 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board SWRU382 November 2014 for TI Sitara Platform Submit Documentation Feedback Copyright 2014 Texas Instruments Incorporated ...

Page 9: ...02 C32 NU_0 1uF 0402 R3 0R 0402 R16 0R 0402 U1 WL1837MODGJ E 13 4X13 3 N100_0 75 TOP GND 17 VIO 38 VBAT 47 EXT_32K 36 BT_AUD_FSYNC 58 BT_AUD_IN 56 BT_AUD_OUT 57 BT_AUD_CLK 60 WL_SDIO_D2 12 WL_SDIO_CLK 8 WL_SDIO_D3 13 WL_SDIO_D0 10 WL_SDIO_D1 11 WL_SDIO_CMD 6 BT_HCI_RTS 50 BT_HCI_RX 53 BT_HCI_TX 52 BT_HCI_CTS 51 GND 16 GPIO_4 25 GPIO_2 26 GPIO_1 27 BT_EN_SOC 41 WLAN_IRQ 14 WLAN_EN_SOC 40 BT_UART_DB...

Page 10: ...acitor 0402 1 pF 50 V C0G GJM1555C1H1R0BB01 0402 C13 1 Murata 0 1 pF 9 Capacitor 0402 2 4 pF 50 V GJM1555C1H2R4BB01 0402 C14 1 Murata C0G 0 1 pF 10 Capacitor 0402 0 1 µF 10 V 0402B104K100CT 0402 C3 C4 2 Walsin X7R 10 11 Capacitor 0402 1 µF 6 3 V GRM155R60J105KE19D 0402 C1 1 Murata X5R 10 HF 12 Capacitor 0603 10 µF 6 3 V C1608X5R0J106M 0603 C2 1 TDK X5R 20 13 Resistor 0402 0R 5 WR04X000 PTL 0402 R1...

Page 11: ... four layers of the WL1837MODCOM8I EVB Figure 7 WL1837MODCOM8I Layer 1 Layout Figure 8 WL1837MODCOM8I Layer 2 Layout 11 SWRU382 November 2014 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform Submit Documentation Feedback Copyright 2014 Texas Instruments Incorporated ...

Page 12: ...WL1837MODCOM8I Layer 4 Layout Figure 11 and Figure 12 show instances of good layout practices 12 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board SWRU382 November 2014 for TI Sitara Platform Submit Documentation Feedback Copyright 2014 Texas Instruments Incorporated ...

Page 13: ...where the module is mounted 3 Have a complete ground pour in layer 2 for thermal dissipation 4 Ensure a solid ground plane and ground vias under the module for stable system and thermal dissipation 5 Increase ground pour in the first layer and have all traces from the first layer on the inner layers if possible 6 Signal traces can be run on a third layer under the solid ground layer and the module...

Page 14: ...ined With Layer 2 Figure 15 and Figure 16 show instances of good layout practices for the antenna and RF trace routing NOTE RF traces must be as short as possible The antenna RF traces and modules must be on the edge of the PCB product The proximity of the antenna to the enclosure and the enclosure material must also be considered 14 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board S...

Page 15: ...e RF trace bends must be gradual with an approximate maximum bend of 45 degrees with trace mitered RF 2 traces must not have sharp corners 3 RF traces must have via stitching on the ground plane beside the RF trace on both sides 4 RF traces must have constant impedance microstrip transmission line For best results the RF trace ground layer must be the ground layer immediately below the RF trace Th...

Page 16: ...D3 in parallel to each other and as short as possible less than 12 cm In addition each trace must be the same length Ensure enough space between traces greater than 1 5 times the trace width or ground to ensure signal quality especially for the SDIO_CLK trace Remember to keep these traces away from the other digital or analog signal traces TI recommends adding ground shielding around these buses D...

Page 17: ...esponsible for compliance with all legal regulatory and safety related requirements concerning its products and any use of TI components in its applications notwithstanding any applications related information or support that may be provided by TI Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failur...

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