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User's Guide

SWRU382 – November 2014

WL1837MODCOM8I WLAN MIMO and Bluetooth

®

Module

Evaluation Board for TI Sitara™ Platform

The WL1837MODCOM8I is a Wi-Fi

®

dual-band,

Bluetooth

, and BLE module evaluation board (EVB) with

the TI WL1837 module (WL1837MOD). The WL1837MOD is a certified WiLink™ 8 module from TI that
offers high throughput and extended range along with Wi-Fi and

Bluetooth

coexistence in a power-

optimized design. The WL1837MOD offers A 2.4- and 5-GHz module solution with two antennas
supporting industrial temperature grade. The module is FCC, IC, ETSI/CE, and TELEC certified for AP
(with DFS support) and client. TI offers drivers for high-level operating systems, such as Linux

®

,

Android™, WinCE, and RTOS.TI.

Contents

1

Overview

......................................................................................................................

3

1.1

General Features

...................................................................................................

3

1.2

Key Benefits

.........................................................................................................

3

1.3

Applications

..........................................................................................................

4

2

Board Pin Assignment

......................................................................................................

4

2.1

Pin Description

......................................................................................................

5

2.2

Jumper Connections

...............................................................................................

7

3

Electrical Characteristics

....................................................................................................

7

4

Antenna Characteristics

.....................................................................................................

8

4.1

VSWR

................................................................................................................

8

4.2

Efficiency

.............................................................................................................

8

4.3

Radio Pattern

........................................................................................................

9

5

Circuit Design

................................................................................................................

9

5.1

EVB Reference Schematics

.......................................................................................

9

5.2

Bill of Materials (BOM)

............................................................................................

10

6

Layout Guidelines

..........................................................................................................

11

6.1

Board Layout

.......................................................................................................

11

7

Ordering Information

.......................................................................................................

16

List of Figures

1

WL1837MODCOM8I EVB (Top View)

....................................................................................

3

2

EVB Top View

................................................................................................................

4

3

EVB (Bottom View)

..........................................................................................................

5

4

Antenna VSWR Characteristics

............................................................................................

8

5

Antenna Efficiency

...........................................................................................................

8

6

EVB Reference Schematics

................................................................................................

9

7

WL1837MODCOM8I Layer 1 Layout

....................................................................................

11

8

WL1837MODCOM8I Layer 2 Layout

....................................................................................

11

9

WL1837MODCOM8I Layer 3 Layout

....................................................................................

12

10

WL1837MODCOM8I Layer 4 Layout

....................................................................................

12

11

Module Layout Guidelines (Top Layer)

..................................................................................

13

Sitara, WiLink are trademarks of Texas Instruments.
Bluetooth is a registered trademark of Bluetooth SIG, Inc.
Android is a trademark of Google, Inc.
Linux is a registered trademark of Linus Torvalds.
Wi-Fi is a registered trademark of Wi-Fi Alliance.

1

SWRU382 – November 2014

WL1837MODCOM8I WLAN MIMO and Bluetooth

®

Module Evaluation Board

for TI Sitara™ Platform

Submit Documentation Feedback

Copyright © 2014, Texas Instruments Incorporated

Summary of Contents for WL1837MODCOM8I

Page 1: ...ections 7 3 Electrical Characteristics 7 4 Antenna Characteristics 8 4 1 VSWR 8 4 2 Efficiency 8 4 3 Radio Pattern 9 5 Circuit Design 9 5 1 EVB Reference Schematics 9 5 2 Bill of Materials BOM 10 6 Layout Guidelines 11 6 1 Board Layout 11 7 Ordering Information 16 List of Figures 1 WL1837MODCOM8I EVB Top View 3 2 EVB Top View 4 3 EVB Bottom View 5 4 Antenna VSWR Characteristics 8 5 Antenna Efficie...

Page 2: ...ttom Layer Antenna and RF Trace Routing Layout Guidelines 15 17 MIMO Antenna Spacing 16 List of Tables 1 Pin Description 5 2 BOM 10 3 Module Layout Guidelines 13 4 Antenna and RF Trace Routing Layout Guidelines 15 2 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board SWRU382 November 2014 for TI Sitara Platform Submit Documentation Feedback Copyright 2014 Texas Instruments Incorporated ...

Page 3: ...ice Shared host controller interface HCI transport for Bluetooth BLE and ANT using UART and SDIO for WLAN Wi Fi and Bluetooth single antenna coexistence Built in chip antenna Optional U FL RF connector for external antenna Direct connection to the battery using an external switched mode power supply SMPS supporting 2 9 to 4 8 V operation VIO in the 1 8 V domain 1 2 Key Benefits The WL1837MOD offer...

Page 4: ...ce is designed for the following applications Portable consumer devices Home electronics Home appliances and white goods Industrial and home automation Smart gateway and metering Video conferencing Video camera and security 2 Board Pin Assignment Figure 2 shows the top view of the EVB Figure 2 EVB Top View 4 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board SWRU382 November 2014 for T...

Page 5: ...7 VBAT P 3 6 V typical voltage input 8 VIO P VIO 1 8 V I O voltage input 9 GND G Ground 10 N C No connection 11 WL_RS232_TX O WLAN tool RS232 output 12 N C No connection 13 WL_RS232_RX I WLAN tool RS232 input 14 N C No connection 15 WL_UART_DBG O WLAN Logger output 16 N C No connection 17 N C No connection 18 GND G Ground 19 GND G Ground 20 SDIO_CLK I WLAN SDIO clock 5 SWRU382 November 2014 WL1837...

Page 6: ... C No connection 44 N C No connection 45 N C No connection 46 N C No connection 47 GND G Ground 48 N C No connection 49 N C No connection 50 N C No connection 51 N C No connection 52 PCM_IF_CLK I O Bluetooth PCM clock input or output 53 N C No connection 54 PCM_IF_FSYNC I O Bluetooth PCM frame sync input or output 55 N C No connection 56 PCM_IF_DIN I Bluetooth PCM data input 57 N C No connection 5...

Page 7: ... No connection 91 N C No connection 92 GND G Ground 93 RESERVED2 I Reserved 94 N C No connection 95 GND G Ground 96 GPIO11 I O General purpose I O 97 GND G Ground 98 GPIO12 I O General purpose I O 99 TCXO_CLK_COM Option to supply 26 MHz externally 100 GPIO10 I O General purpose I O 2 2 Jumper Connections The WL1837MODCOM8I EVB includes the following jumper connections J1 Jumper connector for VIO p...

Page 8: ...ristics Figure 4 Antenna VSWR Characteristics 4 2 Efficiency Figure 5 shows the antenna efficiency Figure 5 Antenna Efficiency 8 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board SWRU382 November 2014 for TI Sitara Platform Submit Documentation Feedback Copyright 2014 Texas Instruments Incorporated ...

Page 9: ...02 C32 NU_0 1uF 0402 R3 0R 0402 R16 0R 0402 U1 WL1837MODGJ E 13 4X13 3 N100_0 75 TOP GND 17 VIO 38 VBAT 47 EXT_32K 36 BT_AUD_FSYNC 58 BT_AUD_IN 56 BT_AUD_OUT 57 BT_AUD_CLK 60 WL_SDIO_D2 12 WL_SDIO_CLK 8 WL_SDIO_D3 13 WL_SDIO_D0 10 WL_SDIO_D1 11 WL_SDIO_CMD 6 BT_HCI_RTS 50 BT_HCI_RX 53 BT_HCI_TX 52 BT_HCI_CTS 51 GND 16 GPIO_4 25 GPIO_2 26 GPIO_1 27 BT_EN_SOC 41 WLAN_IRQ 14 WLAN_EN_SOC 40 BT_UART_DB...

Page 10: ...acitor 0402 1 pF 50 V C0G GJM1555C1H1R0BB01 0402 C13 1 Murata 0 1 pF 9 Capacitor 0402 2 4 pF 50 V GJM1555C1H2R4BB01 0402 C14 1 Murata C0G 0 1 pF 10 Capacitor 0402 0 1 µF 10 V 0402B104K100CT 0402 C3 C4 2 Walsin X7R 10 11 Capacitor 0402 1 µF 6 3 V GRM155R60J105KE19D 0402 C1 1 Murata X5R 10 HF 12 Capacitor 0603 10 µF 6 3 V C1608X5R0J106M 0603 C2 1 TDK X5R 20 13 Resistor 0402 0R 5 WR04X000 PTL 0402 R1...

Page 11: ... four layers of the WL1837MODCOM8I EVB Figure 7 WL1837MODCOM8I Layer 1 Layout Figure 8 WL1837MODCOM8I Layer 2 Layout 11 SWRU382 November 2014 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform Submit Documentation Feedback Copyright 2014 Texas Instruments Incorporated ...

Page 12: ...WL1837MODCOM8I Layer 4 Layout Figure 11 and Figure 12 show instances of good layout practices 12 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board SWRU382 November 2014 for TI Sitara Platform Submit Documentation Feedback Copyright 2014 Texas Instruments Incorporated ...

Page 13: ...where the module is mounted 3 Have a complete ground pour in layer 2 for thermal dissipation 4 Ensure a solid ground plane and ground vias under the module for stable system and thermal dissipation 5 Increase ground pour in the first layer and have all traces from the first layer on the inner layers if possible 6 Signal traces can be run on a third layer under the solid ground layer and the module...

Page 14: ...ined With Layer 2 Figure 15 and Figure 16 show instances of good layout practices for the antenna and RF trace routing NOTE RF traces must be as short as possible The antenna RF traces and modules must be on the edge of the PCB product The proximity of the antenna to the enclosure and the enclosure material must also be considered 14 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board S...

Page 15: ...e RF trace bends must be gradual with an approximate maximum bend of 45 degrees with trace mitered RF 2 traces must not have sharp corners 3 RF traces must have via stitching on the ground plane beside the RF trace on both sides 4 RF traces must have constant impedance microstrip transmission line For best results the RF trace ground layer must be the ground layer immediately below the RF trace Th...

Page 16: ...D3 in parallel to each other and as short as possible less than 12 cm In addition each trace must be the same length Ensure enough space between traces greater than 1 5 times the trace width or ground to ensure signal quality especially for the SDIO_CLK trace Remember to keep these traces away from the other digital or analog signal traces TI recommends adding ground shielding around these buses D...

Page 17: ...esponsible for compliance with all legal regulatory and safety related requirements concerning its products and any use of TI components in its applications notwithstanding any applications related information or support that may be provided by TI Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failur...

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