User's Guide
SWRU382 – November 2014
WL1837MODCOM8I WLAN MIMO and Bluetooth
®
Module
Evaluation Board for TI Sitara™ Platform
The WL1837MODCOM8I is a Wi-Fi
®
dual-band,
Bluetooth
, and BLE module evaluation board (EVB) with
the TI WL1837 module (WL1837MOD). The WL1837MOD is a certified WiLink™ 8 module from TI that
offers high throughput and extended range along with Wi-Fi and
Bluetooth
coexistence in a power-
optimized design. The WL1837MOD offers A 2.4- and 5-GHz module solution with two antennas
supporting industrial temperature grade. The module is FCC, IC, ETSI/CE, and TELEC certified for AP
(with DFS support) and client. TI offers drivers for high-level operating systems, such as Linux
®
,
Android™, WinCE, and RTOS.TI.
Contents
1
Overview
......................................................................................................................
3
1.1
General Features
...................................................................................................
3
1.2
Key Benefits
.........................................................................................................
3
1.3
Applications
..........................................................................................................
4
2
Board Pin Assignment
......................................................................................................
4
2.1
Pin Description
......................................................................................................
5
2.2
Jumper Connections
...............................................................................................
7
3
Electrical Characteristics
....................................................................................................
7
4
Antenna Characteristics
.....................................................................................................
8
4.1
VSWR
................................................................................................................
8
4.2
Efficiency
.............................................................................................................
8
4.3
Radio Pattern
........................................................................................................
9
5
Circuit Design
................................................................................................................
9
5.1
EVB Reference Schematics
.......................................................................................
9
5.2
Bill of Materials (BOM)
............................................................................................
10
6
Layout Guidelines
..........................................................................................................
11
6.1
Board Layout
.......................................................................................................
11
7
Ordering Information
.......................................................................................................
16
List of Figures
1
WL1837MODCOM8I EVB (Top View)
....................................................................................
3
2
EVB Top View
................................................................................................................
4
3
EVB (Bottom View)
..........................................................................................................
5
4
Antenna VSWR Characteristics
............................................................................................
8
5
Antenna Efficiency
...........................................................................................................
8
6
EVB Reference Schematics
................................................................................................
9
7
WL1837MODCOM8I Layer 1 Layout
....................................................................................
11
8
WL1837MODCOM8I Layer 2 Layout
....................................................................................
11
9
WL1837MODCOM8I Layer 3 Layout
....................................................................................
12
10
WL1837MODCOM8I Layer 4 Layout
....................................................................................
12
11
Module Layout Guidelines (Top Layer)
..................................................................................
13
Sitara, WiLink are trademarks of Texas Instruments.
Bluetooth is a registered trademark of Bluetooth SIG, Inc.
Android is a trademark of Google, Inc.
Linux is a registered trademark of Linus Torvalds.
Wi-Fi is a registered trademark of Wi-Fi Alliance.
1
SWRU382 – November 2014
WL1837MODCOM8I WLAN MIMO and Bluetooth
®
Module Evaluation Board
for TI Sitara™ Platform
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Copyright © 2014, Texas Instruments Incorporated
