Texas Instruments WL1835MODCOM8A, User Manual

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Circuit Design
6.2 Bill of Materials (BOM)
Table 1 lists the bill of materials.
Table 1. BOM
1 TI WL1835 WiFi/ Bluetooth Module WL1835MODGA U1
2 XOSC 3225 / 32.768 kHz / 1.8 V / ±50 ppm 7XZ3200005 OSC1
3 ANT / Chip / 2.4 GHz, 5 GHz / Peak Gain >5 dBi ANT016008LCD2442MA1 ANT1, ANT2
4 CON Male 1x2 / Pitch P301-SGP-040/028-02 J1, J3, J4
5 DC JUMPER / PITCH 2.0 mm CMJ-20BB J1, J3
6 Mini RF Header Receptacle U.FL-R-SMT-1(10) J5, J6
7 IND 0402 / 1.1 nH / ±0.05 nH / SMD LQP15MN1N1W02 L1
8 IND 0402 / 1.5 nH / ±0.05 nH / SMD LQP15MN1N5W02 L2
9 CAP 0402 / 1.2 pF / 50 V / C0G / ±0.1 pF GJM1555C1H1R2BB01 C11
10 CAP 0402 / 2.2 pF / 50 V / C0G / ±0.1 pF GJM1555C1H2R2BB01 C9
11 CAP 0402 / 4 pF / 50 V / C0G / ±0.1 pF GJM1555C1H4R0BB01 C14
12 CAP 0402 / 8 pF / 50 V / C0G / ±0.1 pF GJM1555C1H8R0BB01 C13
13 CAP 0402 / 10 pF / 50 V / NPO / ±5% 0402N100J500LT C7, C8
14 CAP 0402 / 0.1 µF / 6.3 V / X7R / ±10% 0402B104K100CT C3, C4
15 CAP 0402 / 1 µF / 6.3 V / X5R / ±10% / HF GRM155R60J105KE19D C1
16 CAP 0603 / 10 µF / 6.3 V / X5R / ±20% C1608X5R0J106M C2
R1, R2, R3, R4, R5, R6, R7, R8, R9,
R10, R11, R12, R13, R14, R15,
17 RES 0402 / 0R / ±5% WR04X000 PTL R16, R17, R18, R19, R21, R22,
R23, R24, R25, R26, R27, R28,
R29, R30, R31, R32
18 RES 0402 / 10K / ±5% WR04X103 JTL R20
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SWRU359A – September 2013 – Revised October 2013 WL1835MODCOM8A WLAN MIMO and BT Module Evaluation Board for TI
Sitara™ Platform
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