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2 SLUUBW3B – October 2018 – Revised June 2020
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UCC2351x Evaluation Module User’s Guide
User's Guide
SLUUBW3B – October 2018 – Revised June 2020
UCC2351x Evaluation Module User’s Guide
1 Introduction
The UCC23513EVM-014 evaluation module is designed for evaluation of TI's 3.75- and 5-kV
RMS
isolated
single-channel gate drivers with opto-compatible inputs including UCC23513, UCC23513B, UCC23513-
Q1, UCC23511, UCC23511-Q1, UCC23313-Q1, and UCC23313B. The input is current driven, requiring
between 7 mA and 16 mA for device turn-on, and can be reverse biased for turn-off. This family of devices
provides high source and sink current drivers for driving Si MOSFETs, IGBTs, and SiC transistors. This
user's guide covers the UCC23513EVM-014, which is used for evaluation of the entire family of pin-to-pin
compatible devices.
Developed for high voltage applications where isolation and reliability are required, the UCC23XXX family
of devices deliver reinforced isolation of 3.75 and 5 kV
RMS
and a surge immunity of up to 8 kV along with a
common-mode transient immunity (CMTI) greater than 150 V/ns. They offer lower propagation delay,
lower-part to-part delay skew, higher CMTI, smaller Pulse Width Distortion, and higher operating
temperature, which provides a significant performance upgrade over opto-isolated gate drivers, while still
maintaining pin-to-pin compatibility.
The input current and voltage characteristics of the e-diode functionally mimics the primary side of an
opto-isolator. The output side VCC has a wide recommended operating range from 14-V to 33-V and
allows the device to be used in a low-side or high-side configuration along with bipolar supplies for IGBTs
and SiC Power FETs. The pin-to-pin compatibility enables designers to use the devices in both existing
and new designs for motor drives, industrial power supplies, solar inverters, and UPSes.
2 Description
The UCC23513EVM-014 evaluation board utilizes a SN74LVC2G17DBVR (dual Schmitt-Trigger buffer) to
drive the signal current on the primary side of the device. The board is populated with test points and 2-
position headers for flexibility in connecting power and signal inputs, along with signal test points and large
GND vias to enable installation of ground springs. The PCB layout is optimized with minimal loop area in
the input and output paths and showcases design for high voltage between the primary side and
secondary side with >8.5 mm creepage. For detailed device information, refer to the individual datasheets
and
TI's Isolated gate driver solutions .
Table 1. EVM Compatible Devices
Part Number Description Package
UCC23513
4-A source / 5-A sink output current, 12-V
UVLO, 5 kV
RMS
Stretched SO-6 package with >8.5-mm
creepage and clearance
UCC23513B
4-A source / 5-A sink output current, 8-V
UVLO, 5 kV
RMS
Stretched SO-6 package with >8.5-mm
creepage and clearance
UCC23513-Q1
Automotive, 4-A source / 5-A sink output
current, 12-V UVLO, 5 kV
RMS
Stretched SO-6 package with >8.5-mm
creepage and clearance
UCC23511
1-A source / 2-A sink output current, 12-V
UVLO, 5 kV
RMS
Stretched SO-6 package with >8.5-mm
creepage and clearance
UCC23511-Q1
Automotive, 1-A source / 2-A sink output
current, 12-V UVLO, 5 kV
RMS
Stretched SO-6 package with >8.5-mm
creepage and clearance
UCC23313-Q1
Automotive, 4-A source / 5-A sink output
current, 12-V UVLO, 3.75 kV
RMS
Stretched SO-6 package with >8.5-mm
creepage and clearance
UCC23313B
4-A source / 5-A sink output current, 8-V
UVLO, 3.75 kV
RMS
Stretched SO-6 package with >8.5-mm
creepage and clearance