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EXAMPLE BOARD LAYOUT
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
(1)
4X (0.65)
(1.95)
6X (0.3)
6X (0.45)
(1.6)
(R0.05) TYP
(
0.2) VIA
TYP
(1.1)
WSON - 0.8 mm max height
DRV0006A
PLASTIC SMALL OUTLINE - NO LEAD
4222173/B 04/2018
SYMM
1
3
4
6
SYMM
LAND PATTERN EXAMPLE
SCALE:25X
7
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown.
SOLDER MASK
OPENING
SOLDER MASK
METAL UNDER
SOLDER MASK
DEFINED
METAL
SOLDER MASK
OPENING
SOLDER MASK DETAILS
NON SOLDER MASK
DEFINED
(PREFERRED)