Texas Instruments TPS274C65, User Manual, Page: 1 / 18

User’s Guide
TPS274C65 Evaluation Module
ABSTRACT
The TPS274C65EVM is a hardware evaluation module (EVM) used to enable hardware engineers to evaluate
the full performance and functionality of the TPS274C65 industrial high side switch. The TPS274C65EVM
contains everything needed to test and assess the TPS274C65 before designing it into part of a greater
application's power system.
The TPS274C65EVM is compatible with AS and BS version of TPS274C65 . To
use the SPI interface of TPS274C65AS and TPS274C65BS correctly, the evaluation module is designed to
either use external microcontroller with jumper wires or in conjunction with an underlying Texas Instruments
microcontroller by using the standardized BoosterPack
™
headers. A wide range of application features such as
SPI communication, adjustable current limiting, and various protection and diagnostics are enabled and visible
through use of this evaluation module.
Table of Contents
1 Introduction ............................................................................................................................................................................. 2
2 Compatibility Across Silicon Versions ................................................................................................................................. 3
3 BoosterPack
™
Operation ....................................................................................................................................................... 4
4 TPS274C65EVM Schematic ................................................................................................................................................... 5
5 Connection Descriptions ....................................................................................................................................................... 6
6 TPS274C65EVM Assembly Drawings and Layout ............................................................................................................... 8
7 Bill of Materials ...................................................................................................................................................................... 11
List of Figures
Figure 4-1. TPS274C65EVM Schematic Drawing....................................................................................................................... 5
Figure 6-1. 3D Representation.................................................................................................................................................... 8
Figure 6-2. Top Layer................................................................................................................................................................... 8
Figure 6-3. Ground Layer............................................................................................................................................................ 9
Figure 6-4. Power Layer.............................................................................................................................................................. 9
Figure 6-5. Bottom Layer........................................................................................................................................................... 10
List of Tables
Table 2-1. Device Comparison Table........................................................................................................................................... 3
Table 2-2. EVM Considerations Across Silicon Versions............................................................................................................. 3
Table 3-1. Connected BoosterPack
™
Header Pins on TPS274C65EVM.................................................................................... 4
Table 5-1. Connections and Test Points...................................................................................................................................... 6
Table 5-2. Jumper Configurations................................................................................................................................................ 6
Table 5-3. ADDCFG DIP Switch Configurations.......................................................................................................................... 7
Table 7-1. TPS274C65 Bill of Materials..................................................................................................................................... 11
Trademarks
BoosterPack ™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
www.ti.com Table of Contents
SLVUCI0 – MAY 2022
Submit Document Feedback
TPS274C65 Evaluation Module 1
Copyright © 2022 Texas Instruments Incorporated