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48-V Telecom Hot-Swap EVM

 

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With the rapid growth of internet and telecommunications in general, more and
more electronic systems are required to run continuously. Therefore,
redundant systems or modules may be required to prevent the crashing of
systems. While redundant systems have proved feasible, they are also very
costly. Further, a simple redundant system as a backup is often inadequate
because any errant part in the backup can jeopardize the whole system. Thus,
we should develop ways to update the system regularly or remove errant parts
and insert new modules while the system is still running. Central to such
requirements for today’s electronic systems is the hot-plug or hot-swap
capability.

The TPS2330 is a single-channel hot-swap controller that uses external
N-channel MOSFETs in hot-swap applications. The device integrates features
such as overcurrent protection, inrush current control, output-power status
reporting, and separation of load transients from actual load increases, which
are the critical requirements for hot-swap applications. For a detailed
description of functions and characteristics of the TPS2300, refer to the data
sheet, literature number SLVS265A. Check data sheet and ordering
information on Web site:

http://focus.ti.com/d

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cs/prod/productfolder.jhtml?

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enericPartNumber=TPS2331

Because telecommunications applications often use –48-V or 48-V power
supplies, a few external components (including a Zener diode and a resistor)
are needed to make the TPS2330 suitable to meet the voltage requirements.
To assist designers in the evaluation of the hot-swap controllers for such high-
voltage applications, a set of evaluation modules has been developed: one is
the 48-V telecom hot-swap EVM, and the other is an interface card.

The following chapters will present the schematics, layouts, and evaluation
procedures for the EVM.

Chapter 2

Summary of Contents for TPS2330

Page 1: ...April 2001 PMP PD PS User s Guide SLVU048...

Page 2: ...esign TI does not warrant or represent that any license either express or implied is granted under any patent right copyright mask work right or other intellectual property right of TI covering or rel...

Page 3: ...is intended for use in a laboratory test environment only It gen erates uses and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuan...

Page 4: ...iv...

Page 5: ...1 3 1 Schematic of the Interface Card SLVP155 3 1 3 2 Schematic of the 48 V Hot Swap EVM SLVP184 3 2 4 1 Top Layer of the Interface Card and Placement of the Components 4 2 4 2 Top Layer of the 48 V...

Page 6: ...Running Title Attribute Reference vi...

Page 7: ...applications but can also be used in very high voltage systems if appropriately designed The TPS2330 is a Texas Instruments hot swap controller that eliminates high frequency hot plug or hot removal...

Page 8: ...1 2 Introduction...

Page 9: ...integrates features such as overcurrent protection inrush current control output power status reporting and separation of load transients from actual load increases which are the critical requirements...

Page 10: ...2 2 48 V Telecom Hot Swap EVM...

Page 11: ...ug events the other is an interface card SLVP155 board that supplies power to the 48 V hot swap board Figures 3 1 and 3 2 show the schematic of the interface card and the schematic of the hot swappabl...

Page 12: ...nent list A key is installed in the edge connector on the interface board SLVP155 to ensure that the hot swap board can only be inserted the right direction Figure 3 2 Schematic of the 48 V Hot Swap E...

Page 13: ...rials RefDes Qty Part Number Description Mfg Size C1 1 08055A102JAT2A Capacitor ceramic 0 001 F 50 V COG 5 AVX 805 C3 1 GRM4034X7R104K50V Capacitor ceramic 0 1 F 25 V X7R 10 Murata 805 C2 C6 C7 3 1206...

Page 14: ...8 on SLVP184 adjust the output turnon ramp up rate and propagation delay time Reducing the capacitance of C8 will increase the output ramp up speed and decreasing the value of C4 will reduce the outpu...

Page 15: ...e components and the top layer layouts for both the 48 V hot swap EVM and the interface card respectively All the components are placed on the top layers except for the 0 1 F capacitor C8 on SLVP184 t...

Page 16: ...4 2 Layouts of the EVM and the Interface Card Figure 4 1 Top Layer of the Interface Card and Placement of the Components Top Layer Top Assembly...

Page 17: ...4 3 Layouts of the EVM and the Interface Card Figure 4 2 Top Layer of the 48 V Hot Swap EVM and Placement of Components Top Layer Top Assembly...

Page 18: ...4 4 Layouts of the EVM and the Interface Card...

Page 19: ...Then turn on the power supply Check the voltage from VIN1 to GND which should be about 48 V 4 Plug the hot swap board SLVP184 into the interface board SLVP155 The key installed between pins 1 and 2 o...

Page 20: ...5 2 Setup of the EVM Figure 5 1 Evaluation Setup of the Hot Swap Board EVM Power Supply 48 V 1 A Supply Plug SLVP184 board into edge connector Note key and slot loctions...

Page 21: ...ground On the 481 V hot swap EVM there are total 7 test points TP1 Gate of the IRF530N MOSFET TP2 Input VIN of TPS2330 TP3 VIN EVM positive input rail same as Vout TP4 Vout EVM positive output rail sa...

Page 22: ...6 2 Test Points...

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