4-1
Layouts of the EVM and the Interface Card
#$ " ! "
The following figures illustrate the placements of the components and the
top-layer layouts for both the 48-V hot-swap EVM and the interface card
respectively. All the components are placed on the top layers except for the
0.1-
µ
F capacitor (C8) on SLVP184 that has now been included on the bottom
layer. (The bottom layers are mainly ground planes).
Chapter 4
Summary of Contents for TPS2330
Page 1: ...April 2001 PMP PD PS User s Guide SLVU048...
Page 4: ...iv...
Page 6: ...Running Title Attribute Reference vi...
Page 8: ...1 2 Introduction...
Page 10: ...2 2 48 V Telecom Hot Swap EVM...
Page 18: ...4 4 Layouts of the EVM and the Interface Card...
Page 22: ...6 2 Test Points...
