background image

STANDARD TERMS FOR EVALUATION MODULES

1.

Delivery:

TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or

documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.

1.1

EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software

1.2

EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.

2

Limited Warranty and Related Remedies/Disclaimers

:

2.1

These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.

2.2

TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques

are

used

to

the

extent

TI

deems

necessary.

TI

does

not

test

all

parameters

of

each

EVM.

User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.

2.3

TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.

WARNING

Evaluation Kits are intended solely for use by technically qualified,

professional electronics experts who are familiar with the dangers

and application risks associated with handling electrical mechanical

components, systems, and subsystems.

User shall operate the Evaluation Kit within TI’s recommended

guidelines and any applicable legal or environmental requirements

as well as reasonable and customary safeguards. Failure to set up

and/or operate the Evaluation Kit within TI’s recommended

guidelines may result in personal injury or death or property

damage. Proper set up entails following TI’s instructions for

electrical ratings of interface circuits such as input, output and

electrical loads.

NOTE:

EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION
KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG.

Summary of Contents for TMUXBQB-DYYEVM

Page 1: ...Figure 4 3 Test Point Colors 7 Figure 5 1 DUT Footprint U1 9 Figure 5 2 Signal Line Circuitry 3D 9 Figure 5 3 Signal Line Circuitry 10 Figure 5 4 Signal Line Circuitry Bottom Layer 10 Figure 6 1 Illus...

Page 2: ...or the quick prototyping and DC characterization of TI s line of TMUX products that use 16 pin TSSOP PW WQFN BQB and SOT 23 THIN DYY packages Figure 1 1 TMUXBQB DYYEVM Top View Introduction www ti com...

Page 3: ...Figure 1 2 TMUXBQB DYYEVM Bottom View www ti com Introduction SCDU029 DECEMBER 2021 Submit Document Feedback TMUXBQB DYYEVM User s Guide 3 Copyright 2021 Texas Instruments Incorporated...

Page 4: ...Figure 1 3 TMUXBQB DYYEVM 3D View Introduction www ti com 4 TMUXBQB DYYEVM User s Guide SCDU029 DECEMBER 2021 Submit Document Feedback Copyright 2021 Texas Instruments Incorporated...

Page 5: ...r supply decoupling capacitors from VSS to GND 1 1 F 1 0 1 F 1 protection diode pad from VSS to GND available near power supply 6 9 mm 5 8 mm Terminal block power supply connection DUT footprint compa...

Page 6: ...connections of the pins of the nearby five headers Figure 4 1 shows a representation of the header associated with pin 3 of U1 Figure 4 1 Header J3 for U1 3 The silkscreen legend represents the connec...

Page 7: ...connected to GND the red test point TP17 is connected to VDD and the green test point TP19 is connected to VSS The remaining blue test points TP1 TP16 and TP101 TP116 are connected along the signal p...

Page 8: ...U1 9 TP110 U1 10 TP111 U1 11 TP112 U1 12 TP113 U1 13 TP114 U1 14 TP115 U1 15 TP116 U1 16 Terminal block J18 is the power input for the board Three power rails VSS GND and VDD are labeled on the board...

Page 9: ...the board Connecting the shunt between pin 4 of the header and pin 3 GND to connect the corresponding pin of U1 to GND Alternatively the pins of U1 can be shorted to VDD or VSS by connecting between...

Page 10: ...side of the board shown in Figure 5 2 and Figure 5 3 as C5 a standard 1206 footprint exists between the U1 pin signal and the GND signal The user can solder a capacitor to this footprint to provide ca...

Page 11: ...hows the layout of the EVM PCB Figure 6 1 Illustration of TMUXBQB DYYEVM Layout www ti com Layout SCDU029 DECEMBER 2021 Submit Document Feedback TMUXBQB DYYEVM User s Guide 11 Copyright 2021 Texas Ins...

Page 12: ...he TMUXBQB DYYEVM that includes all the parts and connections Figure 7 1 TMUXBQB DYYEVM Schematic Page 1 Editor View Schematics www ti com 12 TMUXBQB DYYEVM User s Guide SCDU029 DECEMBER 2021 Submit D...

Page 13: ...4 are schematic views of the TMUXBQB DYYEVM that show only the parts that are included in the EVM and excludes the parts that are DNI www ti com Schematics SCDU029 DECEMBER 2021 Submit Document Feedba...

Page 14: ...0k R14 GND 1 2 3 4 5 6 J2 61300621121 0 R7 GND 450V 0 1uF C2 1 0k R2 VDD TP105 TP5 GND 5 VSS VDD 1 0k R29 GND 1 2 3 4 5 6 J5 61300621121 0 R21 GND 450V 0 1uF C5 1 0k R17 VDD TP108 TP8 GND 8 VSS VDD 1...

Page 15: ...SS VDD 1 2 3 4 5 6 J13 61300621121 TP13 0 R51 1 0k R55 1 0k R49 VDD 450V 0 1uF C13 GN D GN D TP113 13 GN D 1uF 250V C113 0 R52 VSS VDD 1 2 3 4 5 6 J14 61300621121 TP14 0 R53 1 0k R56 1 0k R50 VDD 450V...

Page 16: ...lock 5 mm 3x1 Tin TH 1 LBL1 THT 14 423 10 Brady Thermal Transfer Printable Labels 0 650 1 R5 R6 R7 R8 R9 R10 R11 R12 R21 R22 R23 R24 R25 R26 R27 R28 R37 R38 R39 R40 R41 R42 R43 R44 R51 R52 R53 R54 R59...

Page 17: ...ther than TI b the nonconformity resulted from User s design specifications or instructions for such EVMs or improper system design or c User has not paid on time Testing and other quality control tec...

Page 18: ...These limits are designed to provide reasonable protection against harmful interference in a residential installation This equipment generates uses and can radiate radio frequency energy and if not in...

Page 19: ...instructions set forth by Radio Law of Japan which includes but is not limited to the instructions below with respect to EVMs which for the avoidance of doubt are stated strictly for convenience and s...

Page 20: ...any interfaces electronic and or mechanical between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electr...

Page 21: ...R DAMAGES ARE CLAIMED THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT 9 Return Policy Except as otherwise provided TI does not offer any refunds returns or exchanges Furthe...

Page 22: ...change without notice TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource Other reproduction and display of thes...

Reviews: