Texas Instruments TMUX7211, User Manual

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9 Bill of Materials
Table 9-1 details the EVM bill of materials.
Table 9-1. TMUX721xEVM Bill of Materials
Designator Component Manufactuer Description Quantity
H9, H10, H11, H12 SJ-5303 (CLEAR) 3M Bumpon, Hemisphere, 0.44 X
0.20, Clear
4
C1, C2 C1608X7S2A104K080AB TDK CAP, CERM, 0.1 µF, 100 V, ±10%,
X7S, 0603
2
C3, C4 C2012X7S2A105K125AB TDK CAP, CERM, 1 µF, 100 V, ± 10%,
X7S, 0805
2
C5, C6 CKG45NX7S2A106M500JJ TDK CAP, CERM, 10 µF, 100 V, ± 20%,
X7S, AEC-Q200 Grade 1, 1812
2
J1 PEC02SAAN Sullins Connector
Solutions Header, 100 mil, 2×1, Tin, TH 1
J3, J4, J5, J6 PEC03SAAN Sullins Connector
Solutions Header, 100 mil, 3×1, Tin, TH 4
J7, J8, J9, J10, J11, J12, J13,
J14 61300621121 Wurth Elektronik Header, 2.54 mm, 3×2, Gold, TH 8
J2 691214110003 Wurth Elektronik Terminal Block, 3.5 mm, 3×1, TH 1
R3, R4, R9, R10, R15, R16,
R17, R18, R24, R25, R27,
R28, R34, R35, R37, R38,
R44, R45, R47, R48 RMCF0603ZT0R00 Stackpole Electronics
Inc RES, 0, 1%, 0.1 W, AEC-Q200
Grade 0, 0603
20
SH-J1, SH-J2, SH-J3, SH-J4,
SH-J5, SH-J6, SH-J7, SH-J8 SNT-100-BK-G Samtec Shunt, 100 mil, Gold plated, Black 8
VDD1, VDD2, VSS1, VSS2 5005 Keystone Test Point, Compact, Red, TH 4
D1.0, D1.2, D2.0, D2.2, D3.0,
D3.2, D4.0, D4.2, S1.0, S1.2,
S2.0, S2.2, S3.0, S3.2, S4.0,
S4.2, SEL1.0, SEL1.1,
SEL2.0, SEL2.1, SEL3.0,
SEL3.1, SEL4.0, SEL4.1 5122 Keystone Test Point, Compact, Blue, TH 24
GND1, GND2, GND3, GND4,
GND5, GND6, GND7 5006 Keystone Test Point, Compact, Black, TH 7
10 Related Documentation
• Texas Instruments, Electrostatic Discharge (ESD) application report
Bill of Materials www.ti.com
10 TMUX7211, TMUX7212, and TMUX7213 Evaluation Modules SCDU024 – DECEMBER 2020
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