SWRU326-013
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Table 3-1. Module Layout Guidelines
Reference
(1)
Guideline Description
1
The proximity of ground vias must be close to the pad.
2
Signal traces must not be run underneath the module on the layer where the module is mounted.
3
Have a complete ground pour in layer 2 for thermal dissipation.
4
Have a solid ground plane and ground vias under the module for stable system and thermal dissipation.
5
Increase the ground pour in the first layer and have all of the traces from the first layer on the inner
layers, if possible.
6
Signal traces can be run on a third layer under the solid ground layer, which is below the module
mounting layer.
(1)
See
Figure 3-2
.
Figure 3-2. Module Layout Guidelines
Figure 3-3
shows the trace design for the PCB. A 50-
Ω
impedance match on the trace to the antenna
should be used. Also, 50-
Ω
traces are recommended for the PCB layout.
Table 3-2
lists the distances
shown in
Figure 3-3
.
Figure 3-4
shows layer 1 with the trace to the antenna over ground layer 2.
Table 3-3
and
Figure 3-5
describe instances of good layout practices for the antenna and RF trace routing.
17
SWRU326 – November 2012
Layout Guidelines
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