Hardware Setup
5
SBOU217 – February 2019
Copyright © 2019, Texas Instruments Incorporated
Using the QFN16-DIP-EVM evaluation module
5. Position the separated PCB over the terminal strips and solder each pin. Carefully remove the PCB
from the DIP socket. For best performance, thoroughly clean any solder flux from the PCB and
bake at 85°C for 30 minutes.
Figure 6.