3 Getting Started
This section provides information regarding PGA2500EVMV2 handling and unpacking, as well as the absolute
operating conditions.
3.1 Electrostatic Discharge Warning
Many of the components on the PGA2500EVMV2 are susceptible to damage by electrostatic discharge (ESD).
Customers are advised to observe proper ESD handling precautions when unpacking and handling the EVM.
Failure to observe ESD handling procedures may result in damage to the EVM components.
3.2 Unpacking the EVM
In addition to the PGA2500EVMV2 evaluation module board, order and unpack the MSP-EXP430F5529LP,
MSP430F5529 USB LaunchPad development kit
. Plug in the MSP430 microcontroller on top of the
PGA2500EVMV2, see
Figure 3-1. PGA2500EVMV2 With MSP430
™
Microcontroller Connected
Getting Started
6
PGA2500EVMV2 Evaluation Module
SBOU257 – JUNE 2021
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