Texas Instruments LMZ14201 SIMPLE SWITCHER Manual Download Page 25 | Manualshive

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MECHANICAL DATA

NDW0007A

www.ti.com

TZA07A (Rev D)

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Summary of Contents for LMZ14201 SIMPLE SWITCHER

Page 1: ...3 2 1 42V Max 3A 2A 1A voltage protection short circuit protection output LMZ12003 2 1 20V Max 3A 2A 1A current limit and allows startup into a pre biased Fully Enabled for Webench Power Designer output A single resistor adjusts the switching frequency up to 1 MHz APPLICATIONS ELECTRICAL SPECIFICATIONS Point of Load Conversions from 12V and 24V Input Rail 6W Maximum Total Output Power Time Critica...

Page 2: ...CURRENT A 50 55 60 65 70 75 80 85 90 95 100 0 0 2 0 4 0 6 0 8 1 OUTPUT CURRENT A EFFICIENCY LMZ14201 SNVS649E JANUARY 2010 REVISED MARCH 2013 www ti com System Performance Efficiency VIN 24V VOUT 5 0V Thermal Derating Curve VIN 24V VOUT 5 0V Radiated Emissions EN 55022 Class B from Evaluation Board 2 Submit Documentation Feedback Copyright 2010 2013 Texas Instruments Incorporated Product Folder Li...

Page 3: ...ld is 1 18V nominal 90 mV hysteresis nominal Maximum recommended input level is 6 5V 4 GND Ground Reference point for all stated voltages Must be externally connected to EP 5 SS Soft Start An internal 8 µA current source charges an external capacitor to produce the soft start function This node is discharged at 200 µA during disable over current thermal shutdown and internal UVLO conditions 6 FB F...

Page 4: ...haracteristics 2 If Military Aerospace specified devices are required please contact the Texas Instruments Sales Office Distributors for availability and specifications 3 The human body model is a 100pF capacitor discharged through a 1 5 kΩ resistor into each pin Test method is per JESD 22 114 Operating Ratings 1 VIN 6V to 42V EN 0V to 6 5V Operation Junction Temperature 40 C to 125 C 1 Absolute M...

Page 5: ...tection threshold IFB Feedback input bias current 5 nA IQ Non Switching Input Current VFB 0 86V 1 mA ISD Shut Down Quiescent Current VEN 0V 25 μA Thermal Characteristics TSD Thermal Shutdown Rising 165 C TSD HYST Thermal shutdown hysteresis Falling 15 C θJA Junction to Ambient 4 4 layer JEDEC Printed Circuit Board 19 3 C W 100 vias No air flow 2 layer JEDEC Printed Circuit Board No 21 5 C W air fl...

Page 6: ...PATION W 25 C 1 2 0 8 1 5 1 8 2 5 3 3 EFFICIENCY 50 55 60 65 70 75 80 85 90 95 100 0 0 2 0 4 0 6 0 8 1 OUTPUT CURRENT A 25 C 1 8 1 2 1 5 0 8 3 3 2 5 LMZ14201 SNVS649E JANUARY 2010 REVISED MARCH 2013 www ti com Typical Performance Characteristics Unless otherwise specified the following conditions apply VIN 24V Cin 10uF X7R Ceramic CO 100uF X7R Ceramic Tambient 25 C for efficiency curves and wavefo...

Page 7: ...3 3 5 0 6 0 0 0 2 0 4 0 6 0 8 1 0 1 2 0 0 2 0 4 0 6 0 8 1 OUTPUT CURRENT A DISSIPATION W 25 C 3 3 5 0 6 0 LMZ14201 www ti com SNVS649E JANUARY 2010 REVISED MARCH 2013 Typical Performance Characteristics continued Unless otherwise specified the following conditions apply VIN 24V Cin 10uF X7R Ceramic CO 100uF X7R Ceramic Tambient 25 C for efficiency curves and waveforms Efficiency 36V Input 25 C Dis...

Page 8: ...5 1 8 1 2 2 5 3 3 5 0 EFFICIENCY 50 55 60 65 70 75 80 85 90 95 100 0 0 2 0 4 0 6 0 8 1 OUTPUT CURRENT A 85 C 1 8 1 2 1 5 3 3 2 5 5 0 LMZ14201 SNVS649E JANUARY 2010 REVISED MARCH 2013 www ti com Typical Performance Characteristics continued Unless otherwise specified the following conditions apply VIN 24V Cin 10uF X7R Ceramic CO 100uF X7R Ceramic Tambient 25 C for efficiency curves and waveforms Ef...

Page 9: ... A EFFICIENCY 50 55 60 65 70 75 80 85 90 95 100 0 0 2 0 4 0 6 0 8 1 OUTPUT CURRENT A 85 C 3 3 5 0 6 0 LMZ14201 www ti com SNVS649E JANUARY 2010 REVISED MARCH 2013 Typical Performance Characteristics continued Unless otherwise specified the following conditions apply VIN 24V Cin 10uF X7R Ceramic CO 100uF X7R Ceramic Tambient 25 C for efficiency curves and waveforms Efficiency 36V Input 85 C Dissipa...

Page 10: ...0 5 A Div LMZ14201 SNVS649E JANUARY 2010 REVISED MARCH 2013 www ti com Typical Performance Characteristics continued Unless otherwise specified the following conditions apply VIN 24V Cin 10uF X7R Ceramic CO 100uF X7R Ceramic Tambient 25 C for efficiency curves and waveforms Output Ripple Transient Response 24VIN 3 3VO 1A BW 200 MHz 24VIN 3 3VO 0 5A to 1A Step Figure 27 Figure 28 Thermal Derating V...

Page 11: ...RFBT RFBB CFF Regulator IC VO Internal Passives VOUT GND VIN 1 2 3 4 5 6 7 LMZ14201 www ti com SNVS649E JANUARY 2010 REVISED MARCH 2013 APPLICATION BLOCK DIAGRAM Copyright 2010 2013 Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Links LMZ14201 ...

Page 12: ...se an input voltage below which the circuit will be disabled This implements the feature of programmable under voltage lockout This is often used in battery powered systems to prevent deep discharge of the system battery It is also useful in system designs for sequencing of output rails or to prevent early turn on of the supply as the main input voltage rail rises at power up Applying the enable d...

Page 13: ... soft start capacitor by discharging the SS input to ground with an internal 200 μA current sink The enable input being pulled low Thermal shutdown condition Over current fault Internal Vcc UVLO Approximately 4V input to VIN CO SELECTION None of the required CO output capacitance is contained within the module At a minimum the output capacitor must meet the worst case minimum ripple current rating...

Page 14: ...13 fSW MAX VO VIN MAX 150 nsec 13 This equation can be used to select RON if a certain operating frequency is desired so long as the minimum on time of 150 ns is observed The limit for RON can be calculated as follows RON VIN MAX 150 nsec 1 3 10 10 14 If RON calculated in Equation 11 is less than the minimum value determined in Equation 14 a lower frequency should be selected Alternatively VIN MAX...

Page 15: ... 10 If the output current IO is determined by assuming that IO IL the higher and lower peak of ILR can be determined Be aware that the lower peak of ILR must be positive if CCM operation is required POWER DISSIPATION AND BOARD THERMAL REQUIREMENTS For the design case of VIN 24V VO 3 3V IO 1A TAMB MAX 85 C and TJUNCTION 125 C the device must see a thermal resistance from case to ambient of less tha...

Page 16: ...tionally grounding for both the input and output capacitor should consist of a localized top side plane that connects to the GND exposed pad EP 2 Have a single point ground The ground connections for the feedback soft start and enable components should be routed to the GND pin of the device This prevents any switched or load currents from flowing in the analog ground traces If not properly handled...

Page 17: ... It should also be noted that current limit is dependent on both duty cycle and temperature as illustrated in the graphs in the Typical Performance Characteristics section THERMAL PROTECTION The junction temperature of the LMZ14201 should not be allowed to exceed its maximum ratings Thermal protection is implemented by an internal Thermal Shutdown circuit which activates at 165 C typ causing the d...

Page 18: ...0V X7R 1206 Taiyo Yuden UMK316B7105KL T Cin2 10 µF 50V X7R 1210 Taiyo Yuden UMK325BJ106MM T CO1 1 µF 50V X7R 1206 Taiyo Yuden UMK316B7105KL T CO2 100 µF 6 3V X7R 1210 Taiyo Yuden JMK325BJ107MM T RFBT 3 32 kΩ 0603 Vishay Dale CRCW06033K32FKEA RFBB 1 07 kΩ 0603 Vishay Dale CRCW06031K07FKEA RON 61 9 kΩ 0603 Vishay Dale CRCW060361k9FKEA RENT 68 1 kΩ 0603 Vishay Dale CRCW060368k1FKEA RENB 11 8 kΩ 0603 ...

Page 19: ...ti com SNVS649E JANUARY 2010 REVISED MARCH 2013 Figure 36 Top View and Bottom View of Evaluation PCB Copyright 2010 2013 Texas Instruments Incorporated Submit Documentation Feedback 19 Product Folder Links LMZ14201 ...

Page 20: ... www ti com REVISION HISTORY Changes from Revision D March 2013 to Revision E Page Changed layout of National Data Sheet to TI format 19 20 Submit Documentation Feedback Copyright 2010 2013 Texas Instruments Incorporated Product Folder Links LMZ14201 ...

Page 21: ...gh temperatures TI Pb Free products are suitable for use in specified lead free processes Pb Free RoHS Exempt This component has a RoHS exemption for either 1 lead based flip chip solder bumps used between the die and package or 2 lead based die adhesive used between the die and leadframe The component is otherwise considered Pb Free RoHS compatible as defined above Green RoHS no Sb Br TI defines ...

Page 22: ...UM www ti com 16 Aug 2013 Addendum Page 2 In no event shall TI s liability arising out of such information exceed the total purchase price of the TI part s at issue in this document sold by TI to Customer on an annual basis ...

Page 23: ... Diameter mm Reel Width W1 mm A0 mm B0 mm K0 mm P1 mm W mm Pin1 Quadrant LMZ14201TZ ADJ NOPB TO PMOD NDW 7 250 330 0 24 4 10 6 14 22 5 0 16 0 24 0 Q2 LMZ14201TZX ADJ NOP B TO PMOD NDW 7 500 330 0 24 4 10 6 14 22 5 0 16 0 24 0 Q2 PACKAGE MATERIALS INFORMATION www ti com 16 Aug 2013 Pack Materials Page 1 ...

Page 24: ...Type Package Drawing Pins SPQ Length mm Width mm Height mm LMZ14201TZ ADJ NOPB TO PMOD NDW 7 250 367 0 367 0 45 0 LMZ14201TZX ADJ NOPB TO PMOD NDW 7 500 367 0 367 0 45 0 PACKAGE MATERIALS INFORMATION www ti com 16 Aug 2013 Pack Materials Page 2 ...

Page 25: ...MECHANICAL DATA NDW0007A www ti com TZA07A Rev D TOP SIDE OF PACKAGE BOTTOM SIDE OF PACKAGE ...

Page 26: ...esponsible for compliance with all legal regulatory and safety related requirements concerning its products and any use of TI components in its applications notwithstanding any applications related information or support that may be provided by TI Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failur...

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