Top Copper - 1oz thick [LMX2492.GTL]
6
2 m
ils
th
ic
k t
o
ta
l
Ro4003 (Er=3.38)
CONTROLLED THICKNESS OF
16 MILS THICK
GND Layer [LMX2492.GP1]
FR4 (Er = ~4.6)
18 MILS THICK
Power Layer [LMX2492.G1]
FR4 (Er = ~4.6)
22 MILS THICK
Bottom Copper - Thermal Relief [LMX2492.GBL]
Chapter 4
SNAU160C – March 2014 – Revised November 2014
Board Layers Stackup
Layers of the 4 layer evaluation board shall include: Blue is dielectrics
•
Top layer for high priority high frequency signals (GTL)
–
1 oz CU
•
RO4003 Dielectric, 16 mils
•
Ground plane (GP1)
•
FR4, 18 mils thick.
•
Power plane – VccCLK (GP2)
•
FR4, 22 mils
•
Bottom layer copper clad for thermal relief (GBL)
Table 4-1. Top to Bottom Layer Order:
LMX2492.GTL
(1)
Top Layer
LMX2492.GP1
(2)
GND Plane
LMX2492.G1
(3)
Power
LMX2492.GBL
(4)
Bottom Layer
Figure 4-1. Board Layers Stackup
13
SNAU160C – March 2014 – Revised November 2014
Board Layers Stackup
Copyright © 2014, Texas Instruments Incorporated