LOGO
PCB
Texas Instruments
FID3
DNP
HSDC081
A
PCB Number:
PCB Rev:
Label Assembly Note
ZZ1
This Assembly Note is for PCB labels only
Size: 0.65" x 0.20 "
PCB Label
LBL1
THT-14-423-10
Assembly Note
ZZ2
These assemblies are ESD sensitive, ESD precautions shall be observed.
Assembly Note
ZZ3
These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
Assembly Note
ZZ4
These assemblies must comply with workmanship standards IPC-A-610 Class 2, unless otherwise specified.
Variant/Label Table
Variant
Label Text
001
DS160PR810EVM-RSC
LOGO
PCB
FCC disclaimer
LOGO
PCB
WEEE logo
SH-J8
SH-J1
SH-J6
SH-J4
SH-J2
SH-J5
SH-J7
SH-J3
SH-J14
SH-J9
SH-J15
SH-J10
SH-J16
SH-J11
SH-J12
SH-J13
Assembly Note
ZZ5
Refer to the test procedure for the correct placement of shunts per Variant.
MP1
9B90-0000A
H1
PMSSS 440 0025 PH
H2
PMSSS 440 0025 PH
CE Mark
FID5
DNP
SH-J18
SH-J19
SH-J20
SH-J17
SH-J24
SH-J25
SH-J26
SH-J21
SH-J22
SH-J23
SH-J28
SH-J29
SH-J30
SH-J27
SH-J31
FID1
DNP
FID2
DNP
FID4
DNP
FID6
DNP
Figure 4-8. Hardware Page
Schematics
20
DS160PR810EVM-RSC Evaluation Module (EVM)
SNLU273 – DECEMBER 2020
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