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EXAMPLE STENCIL DESIGN

16X (1.5)

16X (0.45)

14X (0.65)

(5.8)

(R0.05) TYP

TSSOP - 1.2 mm max height

PW0016A

SMALL OUTLINE PACKAGE

4220204/A 02/2017

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE: 10X

SYMM

SYMM

1

8

9

16

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Summary of Contents for DRV8833

Page 1: ...W includes circuitry to regulate or limit the winding current Package Option Outputs can be in Parallel for Internal shutdown functions with a fault output pin are provided for overcurrent protection short circuit 3 A RMS 4 A Peak PWP and RTY protection undervoltage lockout and 1 A RMS 4 A Peak PW overtemperature A low power sleep mode is also Wide Power Supply Voltage Range provided 2 7 to 10 8 V...

Page 2: ...ional Block Diagram 8 11 5 Glossary 17 7 3 Feature Description 9 12 Mechanical Packaging and Orderable 7 4 Device Functional Modes 11 Information 17 8 Application and Implementation 12 4 Revision History NOTE Page numbers for previous revisions may differ from page numbers in the current version Changes from Revision D March 2015 to Revision E Page Updated Features bullets to include specification...

Page 3: ...must be connected to ground Bypass to GND with 2 2 μF 6 3 V VINT 12 14 Internal supply bypass capacitor Connect to motor supply A 10 µF VM 10 12 Device power supply minimum ceramic bypass capacitor to GND is recommended Connect a 0 01 μF 16 V minimum X7R VCP 9 11 IO High side gate drive voltage ceramic capacitor to VM CONTROL Logic input controls state of AOUT1 AIN1 14 16 I Bridge A input 1 Intern...

Page 4: ...stor for bridge AISEN 1 3 IO Bridge A ground ISENSE A or GND if current control not needed Connect to current sense resistor for bridge BISEN 4 6 IO Bridge B ground ISENSE B or GND if current control not needed AOUT1 16 2 O Bridge A output 1 Connect to motor winding A AOUT2 2 4 O Bridge A output 2 BOUT1 5 7 O Bridge B output 1 Connect to motor winding B BOUT2 3 5 O Bridge B output 2 4 Submit Docum...

Page 5: ... control process 2 JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process 6 3 Recommended Operating Conditions TA 25 C unless otherwise noted MIN NOM MAX UNIT VM Motor power supply voltage range 1 2 7 10 8 V VDIGIN Digital input pin voltage range 0 3 5 75 V IOUT RTY package continuous RMS or DC output current per bridge 2 1 5 A 1 RDS ON increases ...

Page 6: ...t high leakage current VO 3 3 V 1 μA H BRIDGE FETs VM 5 V I O 500 mA TJ 25 C 200 VM 5 V IO 500 mA TJ 85 C 325 HS FET on resistance VM 2 7 V I O 500 mA TJ 25 C 250 VM 2 7 V IO 500 mA TJ 85 C 350 RDS ON mΩ VM 5 V I O 500 mA TJ 25 C 160 VM 5 V IO 500 mA TJ 85 C 275 LS FET on resistance VM 2 7 V I O 500 mA TJ 25 C 200 VM 2 7 V IO 500 mA TJ 85 C 300 IOFF Off state leakage current VM 5 V TJ 25 C VOUT 0 ...

Page 7: ...10 8 I VMQ uA VVM V 40 C 25 C 85 C C002 DRV8833 www ti com SLVSAR1E JANUARY 2011 REVISED JULY 2015 Electrical Characteristics continued TA 25 C unless otherwise noted PARAMETER TEST CONDITIONS MIN TYP MAX UNIT CURRENT CONTROL VTRIP xISEN trip voltage 160 200 240 mV tBLANK Current sense blanking time 3 75 µs SLEEP MODE tWAKE Start up time nSLEEP inactive high to H bridge on 1 ms 6 6 Typical Charact...

Page 8: ...on for brushed DC or bipolar stepper motors The device integrates two NMOS H bridges and current regulation circuitry The DRV8833 can be powered with a supply voltage from 2 7 to 10 8 V and can provide an output current up to 1 5 A RMS A simple PWM interface allows easy interfacing to the controller circuit The current regulation is a fixed frequency PWM slow decay The device includes a low power ...

Page 9: ... L decay The inputs can also be used for PWM control of the motor speed When controlling a winding with PWM when the drive current is interrupted the inductive nature of the motor requires that the current must continue to flow This is called recirculation current To handle this recirculation current the H bridge can operate in two different states fast decay or slow decay In fast decay mode the H...

Page 10: ...cycle Immediately after the current is enabled the voltage on the xISEN pin is ignored for a fixed period of time before enabling the current sense circuitry This blanking time is fixed at 3 75 μs This blanking time also sets the minimum on time of the PWM when operating in current chopping mode The PWM chopping current is set by a comparator which compares the voltage across a current sense resis...

Page 11: ...d will be disabled while the other bridge will function normally Overcurrent conditions are detected independently on both high and low side devices that is a short to ground supply or across the motor winding will all result in an overcurrent shutdown Overcurrent protection does not use the current sense circuitry used for PWM current control so it functions even without presence of the xISEN res...

Page 12: ... are connected in parallel to achieve higher current 8 2 Typical Application The two H bridges in the DRV8833 can be connected in parallel for double the current of a single H bridge The internal dead time in the DRV8833 prevents any risk of cross conduction shoot through between the two bridges due to timing differences between the two bridges Figure 7 shows the connections Figure 7 Parallel Mode...

Page 13: ...tor will dissipate 2 A2 0 05 Ω 0 2 W The power quickly increases with higher current levels Resistors typically have a rated power within some ambient temperature range along with a derated power curve for high ambient temperatures When a PCB is shared with other components generating heat margin should be added For best practice measure the actual sense resistor temperature in a final system alon...

Page 14: ...ystem limits the rate current can change from the power supply If the local bulk capacitance is too small the system responds to excessive current demands or dumps from the motor with a change in voltage When adequate bulk capacitance is used the motor voltage remains stable and high current can be quickly supplied The data sheet generally provides a recommended value but system level testing is r...

Page 15: ...m the device For proper operation this pad must be thermally connected to copper on the PCB to dissipate heat On a multilayer PCB with a ground plane this can be accomplished by adding a number of vias to connect the thermal pad to the ground plane On PCBs without internal planes copper area can be added on either side of the PCB to dissipate heat If the copper area is on the opposite side of the ...

Page 16: ...described above If the die temperature exceeds approximately 150 C the device will be disabled until the temperature drops by 45 C Any tendency of the device to enter TSD is an indication of either excessive power dissipation insufficient heatsinking or too high an ambient temperature 10 4 Power Dissipation Power dissipation in the DRV8833 is dominated by the DC power dissipated in the output FET ...

Page 17: ...s Design Support TI s Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support 11 3 Trademarks PowerPAD E2E are trademarks of Texas Instruments All other trademarks are the property of their respective owners 11 4 Electrostatic Discharge Caution These devices have limited built in ESD protection The leads should be shorted togethe...

Page 18: ...at are compliant with the current EU RoHS requirements for all 10 RoHS substances including the requirement that RoHS substance do not exceed 0 1 by weight in homogeneous materials Where designed to be soldered at high temperatures RoHS products are suitable for use in specified lead free processes TI may reference these types of products as Pb Free RoHS Exempt TI defines RoHS Exempt to mean produ...

Page 19: ... better integrate information from third parties TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals TI and TI suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for r...

Page 20: ... A0 Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket Quadrants Sprocket Holes Q1 Q1 Q2 Q2 Q3 Q3 Q4 Q4 User Direction of Feed P1 Reel Diameter All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter mm Reel Width W1 mm A0 mm B0 mm K0 mm P1 mm W mm Pin1 Quadrant DRV8833PWPR HTSSOP PWP 16 2000 330 0 12 4 6 9 5 6 1 6 8 0 12 0 Q1 DRV8833PWR TSSOP PW 16 2000...

Page 21: ... dimensions are nominal Device Package Type Package Drawing Pins SPQ Length mm Width mm Height mm DRV8833PWPR HTSSOP PWP 16 2000 356 0 356 0 35 0 DRV8833PWR TSSOP PW 16 2000 356 0 356 0 35 0 DRV8833RTYR QFN RTY 16 3000 367 0 367 0 35 0 DRV8833RTYT QFN RTY 16 250 210 0 185 0 35 0 Pack Materials Page 2 ...

Page 22: ...ube length T Tube height W Tube width B Alignment groove width All dimensions are nominal Device Package Name Package Type Pins SPQ L mm W mm T µm B mm DRV8833PW PW TSSOP 16 90 530 10 2 3600 3 5 DRV8833PWP PWP HTSSOP 16 90 530 10 2 3600 3 5 Pack Materials Page 3 ...

Page 23: ...r dimensions are in millimeters Any dimensions in parenthesis are for reference only Dimensioning and tolerancing per ASME Y14 5M 2 This drawing is subject to change without notice 3 This dimension does not include mold flash protrusions or gate burrs Mold flash protrusions or gate burrs shall not exceed 0 15 mm per side 4 This dimension does not include interlead flash Interlead flash shall not e...

Page 24: ...ed 6 Publication IPC 7351 may have alternate designs 7 Solder mask tolerances between and around signal pads can vary based on board fabrication site LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE 10X SYMM SYMM 1 8 9 16 15 000 METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METAL EXPOSED METAL SOLDER MASK DETAILS NON SOLDER MASK DEFINED PREFERRED SOLDER MASK DEFINED ...

Page 25: ...4 A 02 2017 NOTES continued 8 Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release IPC 7525 may have alternate design recommendations 9 Board assembly site may have different recommendations for stencil design SOLDER PASTE EXAMPLE BASED ON 0 125 mm THICK STENCIL SCALE 10X SYMM SYMM 1 8 9 16 ...

Page 26: ......

Page 27: ...REA SEE DETAIL A 0 1 C NOTES 1 All linear dimensions are in millimeters Any dimensions in parenthesis are for reference only Dimensioning and tolerancing per ASME Y14 5M 2 This drawing is subject to change without notice 3 This dimension does not include mold flash protrusions or gate burrs Mold flash protrusions or gate burrs shall not exceed 0 15 mm per side 4 Reference JEDEC registration MO 153...

Page 28: ... a thermal pad on the board For more information see Texas Instruments literature numbers SLMA002 www ti com lit slma002 and SLMA004 www ti com lit slma004 9 Size of metal pad may vary due to creepage requirement 10 Vias are optional depending on application refer to device data sheet It is recommended that vias under paste be filled plugged or tented TM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SC...

Page 29: ...5 2 75 X 2 58 0 1 SOLDER STENCIL OPENING STENCIL THICKNESS NOTES continued 11 Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release IPC 7525 may have alternate design recommendations 12 Board assembly site may have different recommendations for stencil design TM SOLDER PASTE EXAMPLE BASED ON 0 125 mm THICK STENCIL SCALE 10X SYMM SYMM 1 8 9 16 METAL COVER...

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Page 33: ...o change without notice TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource Other reproduction and display of these resources is prohibited No license is granted to any other TI intellectual property right or to any third party intellectual property right TI disclaims responsibility for and you will fully indemn...

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