SEL
-
V
S
+V
S
EN
402
W
402
W
R
2
R
1
J1
J2
J4
J6
J5
R
4
R
3
J3
R
5
C
2
C
1
C
3
C
4
V0
V1
V
OUT
Circuit
2
Circuit
The circuit schematic in
shows the connections for all possible components.
Figure 2. Schematic for DEM-OPA-MSOP-1B
3
Components
Components that have RF performance similar to those listed in
may be substituted.
Table 1. Component Descriptions
PART
DESCRIPTION
C
1
, C
2
Tantalum Chip Capacitor, SMD EIA Size 3216, 20V
C
3
, C
4
Multi-Layer Ceramic Chip Capacitor, SMD 0603, 50V
SMA or SMB Board Jack (Amphenol 901-144-8) or Side Mount BNC
J1, J2, J4
Connection (Trompeter Electronics UCBJE20-1)
J3, J5
SMA or SMB Board Jack (Amphenol 901-144-8)
J6
Terminal Block, 3.5mm Centers (On-Shore Technology ED555/3DS)
R
X
Metal Film Chip Resistor, SMD 0603, 1/8W
Please refer to
for the location of the following components:
•
R
1
, R
2
, R
4
set the I/O impedance for the signal chain.
•
R
3
and R
5
set the input impedance for the select and enable pins.
•
C
1
, C
2
, C
3
, and C
4
are supply bypass capacitors.
2
DEM-OPA-MSOP-1B Demonstration Fixture
SBOU044C – April 2007 – Revised April 2015
Copyright © 2007–2015, Texas Instruments Incorporated