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Summary of Contents for CSD87588N

Page 1: ...CSD87588NEVM 603 Schematic 3 2 Tip and Barrel Measurement for Vsw Waveform 4 3 CSD87588NEVM 603 Recommended Test Setup 5 4 Efficiency versus Output Current for CSD87588N 7 5 Switching Node Waveform V...

Page 2: ...ns Table 1 CSD87588NEVM 603 Electrical Performance Specifications PARAMETER TEST CONDITIONS MIN TYP MAX UNIT INPUT CHARACTERISTICS VIN voltage 12 20 V Voltage range 5V voltage 4 5 5 5 5 V OUTPUT CHARA...

Page 3: ...GND 7 PGND 8 V5 9 DL 10 DH 11 SW 12 BST 13 EN 14 MODE 15 PGOOD 16 PWPD 17 U300 TPS51219RTE DNP C307 DNP R305 TP309 330 F C308 330 F C309 10 F C310 0 R306 2 2R R307 GSNS_300 5VIN_300 VSNS_300 2 2 F C31...

Page 4: ...ution 5 V division vertical resolution When measuring the switch node waveform place the negative probe tip on the GND pad of the input cap and positive tip on the CSD87588N Vsw top metal as shown in...

Page 5: ...or to connecting the DC source V5VIN TI recommends to limit the source current from 5V to 0 5 A maximum Ensure that V5VIN is initially set to 0 V and connected as shown in Figure 3 3 Connect a voltmet...

Page 6: ...tion 9 Decrease load to 0 A 10 Put a jumper to short J302 to disable the controller 11 Decrease V5VIN to 0 V 12 Decrease VIN to 0 V 5 2 List of Testpoints Table 2 Function of Each Testpoint Testpoints...

Page 7: ...typical performance curves for CSD87588NEVM 603 1 Efficiency at VO 1 0 V fSW 300 kHz LO 0 36 H TA 25 C Figure 4 Efficiency versus Output Current for CSD87588N Figure 5 Switching Node Waveform Figure...

Page 8: ...was designed using a six layer 1 oz copper circuit board Figure 7 CSD87588NEVM 603 Top Layer Assembly Drawing Top View Figure 8 CSD87588NEVM 603 Bottom Assembly Drawing Bottom View 8 High Power Densit...

Page 9: ...op Copper Top View Figure 10 CSD87588NEVM 603 Internal Layer 1 Top View 9 SLPU002A February 2014 Revised February 2014 High Power Density Low Profile NexFET Power Block II for Notebook Power Supply Su...

Page 10: ...rnal Layer 2 Top View Figure 12 CSD87588NEVM 603 Internal Layer 3 Top View 10 High Power Density Low Profile NexFET Power Block II for Notebook SLPU002A February 2014 Revised February 2014 Power Suppl...

Page 11: ...ternal Layer 4 Top View Figure 14 CSD87588NEVM 603 Bottom Copper Top View 11 SLPU002A February 2014 Revised February 2014 High Power Density Low Profile NexFET Power Block II for Notebook Power Supply...

Page 12: ...08mm Technology 1 L301 0 36uH Inductor 36UH 30A POWER CHOKE 11 7 X 10 0 X ETQP4LR36AFC Panasonic SMD H4 0mm 1 Q301 CSD87588N NANO MPA0005A CSD87588N Texas Instruments 1 R301 10K RES 10 0K OHM 1 16W 1...

Page 13: ...he jumper numbers 4 Updated Figure 2 4 Updated Figure 7 8 Updated Figure 8 8 NOTE Page numbers for previous revisions may differ from page numbers in the current version 13 SLPU002A February 2014 Revi...

Page 14: ...ing the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty If TI elects to repair or replace such EVM TI shall have a reasonable time to repa...

Page 15: ...transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indic...

Page 16: ...ified allowable ranges some circuit components may have elevated case temperatures These components include but are not limited to linear regulators switching transistors pass transistors current sens...

Page 17: ...REMOVAL OR REINSTALLATION ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES RETESTING OUTSIDE COMPUTER TIME LABOR COSTS LOSS OF GOODWILL LOSS OF PROFITS LOSS OF SAVINGS LOSS OF USE L...

Page 18: ...sponsible for compliance with all legal regulatory and safety related requirements concerning its products and any use of TI components in its applications notwithstanding any applications related inf...

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