Additional Information
21
SWAU106 – January 2019
Copyright © 2019, Texas Instruments Incorporated
CC3135 SimpleLink™ Wi-Fi
®
BoosterPack™ Development Kit (BOOSTXL-
CC3135)
5
Additional Information
5.1
Design Files
All design files including schematics, layout, bill of materials (BOM), Gerber files, and documentation are
available for download from:
CC3135 SimpleLink WI-Fi and Internet of Things - Hardware Design Files
.
5.2
Software
All design files including TI-TXT object-code firmware images, software example projects, and
documentation are available at
The Software Development Kit (SDK) to use with the CC3135 BoosterPack™ is available at
http://www.ti.com/tool/SIMPLELINK-WIFI-CC3120-SDK-PLUGIN
5.3
Hardware Change Log
lists the hardware change log.
Table 8. Hardware Change Log
PCB Revision
Description
Rev A
First release
5.4
Known Limitations
5.4.1
Enabling Low-Power Measurement From the LaunchPad™ Kit
When the BOOSTXL-CC3135 is powered by a LaunchPad™ kit, the 3.3-V supply from the LaunchPad is
used to power the CC3135 BoosterPack™ module, as well as other parts on the board including the serial
flash, LEDs, and more. The total power drawn into the 3.3-V supply would be several mA in shutdown or
hibernate mode. To measure the low-power numbers, users are advised to remove the LEDs (D1, D5, and
D6 on the board). Similarly, the shutdown mode would leak about 33 µA into the pullup resistor (R27) on
the nRESET pin. This pullup resistor also must be removed to measure the total current below 1 µA in
shutdown mode. In hibernate mode, pullup resistor
R296
must be removed to enable the lowest current
state.
