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Bill of Materials
18
T
able 4.
Bill of Materials
(continued)
Qty
V
endor
Description
Components
Part Number
4
SO1, SO2, SO3, SO4
Standof
f FF
4
ADT1−1WT
T1, T2, T3, T4
Mini-Circuits
3
5006K−ND
TP1, TP5, TP6
T
est Point, Black
Digi-Key
3
5007K−ND
TP2, TP3, TP4
T
est Point, White
Digi-Key
2
TPS78633
U1, U3
SOT223−5
TI
1
TPS78618
U2
SOT223−5
TI
1
XC18V01VQ44
U5
QFP44
Digi-Key
1
XCV100E−6PQ240C
U6
HQFP240
Digi-Key
1
DLP−USB245M
U7
Mouser/DLP Design
1
DAC2902
U8
TQFP−48
TI
Summary of Contents for AFEDRI8201EVM
Page 1: ...August 2005 User s Guide SBAU099B High Speed Communications...
Page 15: ...Physical Description 9 AFEDRI8201EVM Figure 2 Schematic AFEDRI8201...
Page 16: ...Physical Description 10 Figure 3 Schematic Xilinx...
Page 17: ...Physical Description 11 AFEDRI8201EVM Figure 4 Schematic Power Supply...
Page 18: ...Physical Description 12 Figure 5 PCB Layout Top Layer top view...
Page 19: ...Physical Description 13 AFEDRI8201EVM Figure 6 PCB Layout Ground Plane top view...
Page 20: ...Physical Description 14 Figure 7 PCB Layout Power Plane top view...
Page 21: ...Physical Description 15 AFEDRI8201EVM Figure 8 PCB Layout Bottom Layer bottom view...