TXMC885 User Manual Issue 1.0.0
Page 7 of 12
2 Technical Specification
XMC Interface
Mechanical Interface
Switched Mezzanine Card (XMC) Interface confirming to ANSI/VITA
42.0-2008 (Auxiliary Standard)
Standard single-width (149mm x 74mm)
Electrical Interface
PCI Express (Base Specification 1.1) compliant interface conforming
to ANSI/VITA 42.3-2006 (XMC PCI Express Protocol Layer
Standard)
On Board Devices
PCIe Switch
89HPES8T5A (IDT)
Gigabit Ethernet Controller
For each interface: 82574IT (Intel)
IPMI resource FRU Data EEPROM
M24C02 (STMicroelectronics)
Ethernet Interface
Number of Interfaces
4
Link
10Base-T / 100Base-TX / 1000Base-T
FIFO
For each interface: Configurable receive and transmit data FIFO,
programmable in 1 KB increments
Interrupts
PCIe Switch is able to generate
•
INTx (x= A, B, C, or D) legacy interrupts
•
Message Signaled Interrupts (MSIs)
I/O Connector
RJ45 jacks (Tyco 406732-2 or compatible)
Physical Data
Ambient Air Cooling
Constant airflow of 2 m/s required
Power Requirements
300mA typical @ VPWR = +12V DC (no link)
app. additional 3mA per 100Mbit/s link
app. additional 100mA per 1Gbit/s link
750mA typical @ VPWR = +5V DC (no link)
app. additional 7mA per 100Mbit/s link
app. additional 250mA per 1Gbit/s link
Temperature Range
Operating
Storage
-40°C to +85°C
-40°C to +85°C
MTBF
483000 h
MTBF values shown are based on calculation according to MIL-HDBK-217F and
MIL-HDBK-217F Notice 2; Environment: G
B
20°C.
The MTBF calculation is based on component FIT rates provided by the component
suppliers. If FIT rates are not available, MIL-HDBK-217F and MIL-HDBK-217F Notice
2 formulas are used for FIT rate calculation.
Humidity
5 – 95 % non-condensing
Weight
79 g
Table 2-1 : Technical Specification
