xE70-915 RF Module User Guide
1VV0301106
rev.3 – 2015-03-04
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights
Reserved.
Page 24 of 34
5.4.
Solder paste
xE70-915 module is designed for reflow soldering process. For proper module assembly,
solder paste must be printed on the target surface of the host board. The solder paste should be
eutectic and made of 95.5% of SN, 4% of Ag and 0.5% of Cu. The recommended solder paste
height is 180
µ
m.
5.5.
Placement
The xE70-915 module can be automatically placed on host boards by pick-and-place
machines like any integrated circuit
5.6.
Soldering Profile (RoHS Process)
It must be noted that xE70-915 module should not be allowed to be hanging upside down
during the reflow operation. This means that the module has to be assembled on the side of
the printed circuit board that is soldered last.
The recommendation for lead-free solder reflow in IPC/JEDEC J-STD-020D Standard should
be followed.
