WL865E4-P Module Hardware User Guide
1VV0301580 Rev. 4
Page
44
of
56
2019-08-08
We recommend using only “no clean” solder paste in order to avoid the cleaning of the
modules after assembly.
Solder Reflow
Recommended solder reflow profile
Figure 12: Solder Reflow profile
Profile Feature
Pb-Free Assembly
Average ramp-up rate (TL to TP)
3°C/second max
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
– Ramp-up Rate
3°C/second max
Time maintained above:
– Temperature (TL)
– Time (tL)
217°C
60-150 seconds
Peak Temperature (Tp)
245 +0/-5°C
Time within 5°C of actual Peak
Temperature (tp)
10-30 seconds
Ramp-down Rate
6°C/second max.
Time 25°C to Peak Temperature
8 minutes max.
Table 21: Solder Reflow Table
