SE873 Family Product User Guide
Product Packaging and Handling
1VV0301216
Rev.4
Page 55 of 69
2018-08-24
Moisture Sensitivity
Precautionary measures are required in handling, storing and using these devices to avoid
damage from moisture absorption. If localized heating is required to rework or repair the device,
precautionary methods are required to avoid exposure to solder reflow temperatures that can
result in performance degradation.
The SE873 module has a moisture sensitivity level rating of 3 as defined
by IPC/JEDEC J-STD-
020
. This rating is assigned due to some of the components used within the module.
The SE873 packaging is hermetically sealed with desiccant and humidity indicator card. The
SE873 parts must be placed and reflowed within 168 hours of first opening the hermetic seal
provided the factory conditions are less than 30°C and less than 60% and the humidity indicator
card indicates less than 10% relative humidity.
If the package has been opened or the humidity indicator card indicates above 10%, then the
parts must be baked prior to reflow. The parts may be baked at +125°C ± 5°C for 48 hours.
However, the tape and reel cannot withstand that temperature. Lower temperature baking is
feasible if the humidity level is low and time is available. Please see
IPC/JEDEC J-STD-033
for
additional information.
Additional information can be found on the MSL tag affixed to the outside of the hermetically
sealed bag.
JEDEC standards are available free of charge from the JEDEC website
Summary of Contents for SE873 Series
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