SC872-A
Product User Guide
Packaging & Handling
1VV0301202 Rev. 6
Page 43 of 53
2018-12-21
Moisture Sensitivity
Precautionary measures are required in handling, storing and using these devices to avoid
damage from moisture absorption. If localized heating is required to rework or repair the device,
precautionary methods are required to avoid exposure to solder reflow temperatures that can
result in performance degradation.
The module is a Moisture Sensitive Device (MSD) Level 3 as defined by
IPC/JEDEC J-
STD-020
. This rating is assigned due to some of the components used within the module.
Please follow the MSD and ESD handling instructions on the labels of the MBB and exterior
carton.
The modules are supplied in a hermetically sealed bag with desiccant and humidity indicator
cards. The module must be placed and reflowed within 168 hours of first opening the hermetic
seal provided the factory ambient conditions are < 30°C and < 60% R. H., and the humidity
indicator card indicates less than 10% relative humidity.
If the package has been opened or the humidity indicator card indicates above 10%, then the
parts will need to be baked prior to reflow. The parts may be baked at +90°C ± 5°C for 96 hours.
However, the packaging materials (trays) can NOT withstand that temperature.
Lower temperature baking is feasible if the humidity level is low and time is available.
Please see
IPC/JEDEC J-STD-033 “Handling, Packing, Shipping and Use of
Moisture/Reflow Sensitive Surface Mount Devices
” for additional information.
Please refer to the MSL tag affixed to the outside of the hermetically sealed bag.
Note:
JEDEC standards are available at no charge from the JEDEC website
