NL865B1 HW Design Guide
1VV0301450 Rev. 1
Page
59
of
72
2017-11-20
9. PACKING SYSTEM
Tray
The NL865B1 modules are packaged on trays
The tray is JEDEC compliant, injection molded antistatic Modified Polyphenylene ether
(MPPO). It has good thermal characteristics and can withstand a standard baking
temperature of up to 125°C, thereby avoiding handling the modules if baking is required.
The trays are rigid, thus providing mechanical protection against transport stress. In
addition, they are re-usable and so environmentally sustainable.
There are 2 (two) antistatic rubber bands that enclose each envelope.
The carton box is rigid, offering mechanical protection. The carton box has one flap across
the entire top surface. It is sealed with tape along the edges of the box.
Table 1: Tray Packing
Modules per
Tray
Trays per
Envelope
Modules per
Envelope
Envelopes per Carton
Box
Modules per
Box
40
5+ 1 empty
200
4
800
Table 2: Packing Quantities
Order Type
Quantity
Minimum Order Quantity (MOQ)
40
Standard Packing Quantity (SPQ)
200
