NE866B1_Hardware_Design_Guide
1VV0301354 Rev. 6
Page
57
of
70
2018-02-28
9. PACKING SYSTEM
Tray
The NB866B1 modules are packaged on trays
The tray is JEDEC compliant, injection molded antistatic Modified Polyphenylene ether
(MPPO). It has good thermal characteristics and can withstand a standard baking
temperature of up to 125°C, thereby avoiding handling the modules if baking is required.
The trays are rigid, thus providing mechanical protection against transport stress. In
addition, they are re-usable and so environmentally sustainable.
There are 2 (two) antistatic rubber bands that enclose each envelope.
The carton box is rigid, offering mechanical protection. The carton box has one flap across
the entire top surface. It is sealed with tape along the edges of the box.
Table 1: Tray Packing
Modules per
Tray
Trays per
Envelope
Modules per
Envelope
Envelopes per Carton
Box
Modules per
Box
98
4+ 1 empty
392
5
1960
Table 2: Packing Quantities
Order Type
Quantity
Minimum Order Quantity (MOQ)
98
Standard Packing Quantity (SPQ) 392