L
LE920 Hardware User Guide
1vv0301026 Rev.0 - draft4 – 2013-05-
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
Page 66 of 76
13.7.
Solder Paste
Solder Paste
Lead free
Sn/Ag/Cu
We recommend using only “no clean” solder paste in order to avoid the cleaning of the
modules after assembly.
13.7.1.
Solder Reflow
Recommended solder reflow profile: