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Telit Wireless Solutions LE915A P Series, Hw Design Manual

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Telit Wireless Solutions LE915A P Series Hw Design Manual Download Page 14

                  
                LE915Ax-P

 Hardware Design Guide

 

 

 
 
1VV0301680  Rev. 2  

Page 14 of 51 

2021-10-04 

Not  Subject to NDA 

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Summary of Contents for LE915A P Series

Page 1: ...LE915Ax P HW Design Guide 1VV0301680 Rev 2 2021 10 04 Telit Technical Documentation...

Page 2: ...LE915Ax P Hardware Design Guide 1VV0301680 Rev 2 Page 2 of 51 2021 10 04 Not Subject to NDA APPLICABILITY TABLE PRODUCTS LE915A6 P LE915A4 P...

Page 3: ...Cellular Frequency Bands and CA Combinations 8 2 2 1 Frequency Bands 8 2 2 2 Carrier Aggregation LE915A6 P only 8 Target Market 8 Main Features 9 TX Output Power 9 RX Sensitivity 9 Mechanical Specifi...

Page 4: ...USB 2 0 Interface 22 5 2 2 UART Interfaces 23 5 2 2 1 RS232 Level Translation 25 General Purpose I O 26 LED Indication 27 External SIM Holder 27 Reserved Pins 28 6 RF SECTION 29 Antenna Requirements 2...

Page 5: ...TY INFORMATION 45 Copyrights and Other Notices 45 11 1 1 Copyrights 45 11 1 2 Computer Software Copyrights 45 Usage and Disclosure Restrictions 46 11 2 1 License Agreements 46 11 2 2 Copyrighted Mater...

Page 6: ...dules Information The Integration of LTE CBRS LE915Ax P cellular modules in single mode within a user application must be performed according to the design rules described in this manual The informati...

Page 7: ...astrophic equipment failure or personal injury may occur Warning Alerts the user on important steps about the module integration Note Tip Provides advice and suggestions that may be useful when integr...

Page 8: ...RA Band Freq MHz UL DL Frequency MHz Duplex Mode 42 3500 3400 3600 TDD 43 3700 3600 3800 TDD 48 3500 3550 3700 TDD Table 2 Frequency bands supported 2 2 2 Carrier Aggregation LE915A6 P only Following...

Page 9: ...eed UARTs w o flow control Cellular technology LE915A6 P LTE CAT 6 TDD 200Mbps on DL 3GPP release 10 LE915A4 P LTE CAT 4 TDD 100Mbps on DL 3GPP release 9 Diversity 2nd RX 4G all operating on all suppo...

Page 10: ...m Width 29 mm Thickness 2 4 mm 2 7 2 Weight The nominal weight of the LE915Ax P family is 5 1 grams Temperature Range Tempeurature Range Note Recommended Operating Temperature Range 3GPP compliant 30...

Page 11: ...end to DTE 1 8V UART2 21 UART0_SIN I Serial data input from DTE 1 8V UART0 22 UART0_SOUT O Serial data output to DTE 1 8V UART0 119 UART1_SIN I Serial data input from DTE 1 8V UART1 131 UART1_SOUT O S...

Page 12: ...or debugging 122 TDI I Reserved JTAG for debugging 133 TCK I Reserved JTAG for debugging 134 TDO O Reserved JTAG for debugging Power Supply 59 VBAT1 Main power supply Baseband 3 8V nominal Power 60 VB...

Page 13: ...r 93 GND Ground Power 94 GND Ground Power 95 GND Ground Power 96 GND Ground Power 97 GND Ground Power 98 GND Ground Power 99 GND Ground Power 100 GND Ground Power 101 GND Ground Power 102 GND Ground P...

Page 14: ...RESERVED 9 RESERVED RESERVED 14 RESERVED RESERVED 15 RESERVED RESERVED 16 RESERVED RESERVED 17 RESERVED RESERVED 19 RESERVED RESERVED 20 RESERVED RESERVED 27 RESERVED RESERVED 28 RESERVED RESERVED 30...

Page 15: ...ERVED RESERVED 47 RESERVED RESERVED 48 RESERVED RESERVED 49 RESERVED RESERVED 50 RESERVED RESERVED 51 RESERVED RESERVED 52 RESERVED RESERVED 53 RESERVED RESERVED 54 RESERVED RESERVED 55 RESERVED RESER...

Page 16: ...tage 3 8V Operating Voltage Range 3 3 V 4 4 V Maximum ripple on module input supply 30mV Table 9 Power Supply Requirements The minimum operating voltage acceptable for LE915Ax P is 3 3 V Special care...

Page 17: ...ply Design Guidelines The desired output for the power supply is 3 8V so there s not a big difference between the input source and the desired output and a linear regulator can be used A switching pow...

Page 18: ...cover with a thermal interface material and making an air flow mechanism for cooling down the heat is also highly recommended Applying a cooling down system in the customer application design is much...

Page 19: ...MI due to switching it is important to keep the mesh involved very small therefore the input capacitor the output diode if not embodied in the IC and the regulator must form a very small loop This is...

Page 20: ...LE915Ax P Hardware Design Guide 1VV0301680 Rev 2 Page 20 of 51 2021 10 04 Not Subject to NDA Figure 2 Recommended Circuit of EMI filter...

Page 21: ...y VBAT1 and VBAT2 Step 2 Wait until the VBAT1 and VBAT2 power supply are stable enough as over than 3 3V minimum operating voltage Step 3 Set RESET_N port to HIGH Step 4 Wait until the URC SYSSTART is...

Page 22: ...ly routed Trace lengths channel number and capacitive loading should be minimized The characteristic impedance value should be as close as possible to the 90 Ohms differential ESD protection can be ad...

Page 23: ...ARTs up to 115200bps without flow control Table 14 UART interfaces Several configurations can be designed for the serial port on the OEM hardware but the most common are RS232 PC com port microcontrol...

Page 24: ...re CMOS 1 8V Note When UART signals are used as the communication port between the host and the modem and flow control is not used UART2_CTS line must set to logical LOW If the UART port is not used a...

Page 25: ...rface without HW flow control 5 2 2 1 RS232 Level Translation Depending on the serial port type on the application side a level translator circuit may be required The nominal voltage level of the UART...

Page 26: ...transducer on the side of the module that is LE915Ax P inputs will damage the inputs of the module if the level translator is also powered with nominal power of 3 8V Therefore the IC of the level tran...

Page 27: ...t below Table 16 LED indication Figure 8 LED Indicator Reference Schematic External SIM Holder LE915Ax P modules support single SIM interface On the application side a pull up resistor needs to be con...

Page 28: ...void floating and to ensure that the SIM is always detected as present A typical interface circuit is shown below It is recommended to keep the traces between the module and the SIM holder as short as...

Page 29: ...na and Transmission line requirement 6 1 1 PCB Design Guidelines When using the LE915Ax P family since there s no antenna connector on the module the antenna must be connected to the LE915Ax P antenna...

Page 30: ...mission line footprint with other signal tracks on different layers the ground surrounding the antenna line on the PCB must be tightly connected to the main Ground Plane through holes at east once eve...

Page 31: ...TanD 0 019 0 026 1 GHz A characteristic impedance of nearly 50 is achieved using a track width 1 1 mm clearance from a coplanar ground plane 0 3 mm each side The line uses the reference ground plane...

Page 32: ...t of line under test is shown below Figure 11 Return Loss plot of line under test The input impedance of the line in Smith Chart format once the line has been terminated to 50 load is shown in the fol...

Page 33: ...perturb the radiation pattern described in the documentation of the Antenna manufacturer It is preferable to get an omnidirectional radiation pattern The Antenna Gain must not exceed the values indica...

Page 34: ...LE915Ax P Hardware Design Guide 1VV0301680 Rev 2 Page 34 of 51 2021 10 04 Not Subject to NDA 7 MECHANICAL DESIGN Drawing Figure 14 Mechanical Design Drawing...

Page 35: ...ads the solder mask opening is larger than the metal pad and does not overlap the metal The metal edge defines the solderable area of the pad see Figure below Since the metal etching process in PCB ma...

Page 36: ...p up Rate 3 0 2 C second Ramp down Rate 2 0 1 C second Table 21 Profile Feature Recommendations Note All temperatures refer to topside of the package measured on the package body surface Warning THE L...

Page 37: ...s of the Telit module and the application PCB should be performed The best visual inspection tool for inspection of the Telit module solder joints on the PCB is a transmission X ray which can identify...

Page 38: ...NDA 9 PACKAGING Reel The LE915Ax P is delivered in Tape and Reel One reel can hold up to 500 pieces Each reel is included in a box and a carton can contain five boxes hence up to 2500 pieces Figure 1...

Page 39: ...tail Figure 19 Packaging Detail Moisture Sensitivity The LE915Ax P family is a Moisture Sensitive Device level 3 in accordance with the IPC JEDEC J STD 020 standard takes care all related requirements...

Page 40: ...ondition during the production 30 C 60 RH according to IPC JEDEC J STD 033A paragraph 5 c The maximum time between the opening of the sealed bag and the reflow process must be 168 hours if condition b...

Page 41: ...munications However there is no guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference to radio or television reception which can be...

Page 42: ...ile RF exposure use condition Any other condition of use such as co location with other transmitter s or use in portable conditions will require a separate re evalutatio through a class II permissive...

Page 43: ...subsystem and its certification does not cover the FCC Part 15 Subpart B unintentional radiator rule requirement applicable to the final host The final host will still need to be reassessed for compli...

Page 44: ...ce The final product must be reassessed against all FCC essential requirements such as FCC Part 15 Subpart B before it can be placed on the US market This includes reassessing the transmitter module f...

Page 45: ...necessarily mean that Telit intends to announce such Telit products programming or services in your country 11 1 1 Copyrights This instruction manual and the Telit products described herein may includ...

Page 46: ...is document is owned by Telit and its licensors It is furnished by express license agreement only and shall be used exclusively in accordance with the terms of such agreement 11 2 2 Copyrighted Materi...

Page 47: ...FOR A PARTICULAR PURPOSE NO THIRD PARTY LICENSORS OF OTHER CODES MUST BE LIABLE FOR ANY DIRECT INDIRECT INCIDENTAL SPECIAL EXEMPLARY OR CONSEQUENTIAL DAMAGES INCLUDING WITHOUT LIMITATION LOST OF PROFI...

Page 48: ...truction for its use Do not insert or remove the SIM when the product is in power saving mode The system integrator is responsible for the functioning of the final product Therefore the external compo...

Page 49: ...k ESD Electrostatic Discharge ESR Equivalent Series Resistance E UTRA Evolved Universal Terrestrial Radio Access LCC Leadless Chip Carrier LTE Long Term Evolution M2M Machine to machine POS Point of S...

Page 50: ...09 24 Temperature range updated UART diagram updated Added GPIOs related description Max data rate described in the USB and UART interfaces Description changes on LED indication Updated the decriptio...

Page 51: ......

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