GE865 Hardware User Guide
1vv0300799 Rev.17– 2017-05-11
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 67 of 75
13.7.1.
GE865 Solder reflow
The following is the recommended solder reflow profile
Profile Feature
Pb-Free Assembly
Average ramp-up rate (T
L
to T
P
)
3°C/second max
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
– Ramp-up Rate
3°C/second max
Time maintained above:
– Temperature (TL)
– Time (tL)
217°C
60-150 seconds
Peak Temperature (Tp)
245 +0/-5°C
Time within 5°C of actual Peak
Temperature (tp)
10-30 seconds
Ramp-down Rate
6°C/second max.
Time 25°C to Peak Temperature
8 minutes max.
