GE865 Hardware User Guide
1vv0300799 Rev.17– 2017-05-11
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 66 of 75
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Finish
Layer thickness [µm]
Properties
Electro-less Ni /
Immersion Au
3 –7 /
0.05 – 0.15
good solder ability protection,
high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the lead-free
process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tin-
lead solder paste on the described surface plating is better compared to lead-free solder paste.
13.7.
Solder paste
Lead free
Solder paste
Sn/Ag/Cu
It is recommended to use only “no clean” solder paste in order to avoid the cleaning of the
modules after assembly.