GS2011M Low Power Wi-Fi Module Hardware User Guide
1VV0301482 Rev. 5.0
Page
63
of
69
2018-01-10
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Keep high speed signals away from RF areas of module.
5. For area under Module, we recommend two options:
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No metal of any kind under module “not on any layer”
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Having full GND plane under module (layer 1 or layer 2) with no “HOT” vias under
module (over 100KHz) and may route signals below GND plane. Also no metal traces are
to be present in the circle, around shield and alignment holes.
6.
If any metal is present on layer 1 then extra thick solder mask under the module is required
7. In performing SMT or manual soldering of the module to the base board, first align the row
of pins from #18 through #31 onto the base board and then match the other two rows.
In addition to the guidelines, note the following suggestions:
1. External Bypass capacitors for all module supplies should be as close as possible to the
module pins.
2. Never place the antenna very close to metallic objects.
3. External monopole antennas need a reasonable ground plane area for antenna efficiency.
4. Do not use a metallic or metalized plastic for the end product enclosure when using
on-board antenna.
5. If the module is enclosed in a plastic case, have reasonable clearance from plastic case to
on-board antenna.
5.1.1 Surface Mount Assembly
The reflow profile is shown in
. The recommended reflow parameters are
summarized in
Figure 9 Reflow Temperature Profile
Summary of Contents for GainSpan GS2011M
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