S50 Hardware User Guide
1VV0301505 Rev. 1
Page
39
of
53
2018-03-02
Cleaning
In general, cleaning the modules mounted on the host board is strongly discouraged.
Residues between module and host board cannot be easily removed with any cleaning
method.
•
Cleaning with water or any organic solvent can lead to capillary effects where the
cleaning solvent is absorbed into the gap between the module and the host board.
The combination of soldering flux residues and encapsulated solvent could lead to
short circuits between conductive parts. The solvent could also damage any
labels.
•
Ultrasonic cleaning could damage the module permanently. Especially for crystal
oscillators the risk of damaging is very high.
8.
APPLICATION DIAGRAM
Figure 29 shows a typical application of S50. The module is connected to some
MCU running the application layer. MCU and S50 use the same 3,3V power
supply. The serial interface has RTS/CTS flow control and UICP support in this example.
The optional hangup feature to close down the link is provided.
All other module pins may be left unconnected.
Host MCU
VDD
GND
+3V3
GPIO (o)
In this example S50/AI is connected to an MCU supporting UICP, RTS/CTS flow control and Hangup.
S50/AI
E-6,F-6
VSUP
B-1 EXT-RES#
UART-RXD
UART-TXD
UART-CTS#
UART-RTS#
GPIO[4]/Hangup
TXD (o)
RXD (i)
RTS# (o)
CTS# (i)
GPIO (o)
B-4
D-4
all GND pads (14) must be connected.
Blocking capacitors not shown.
pushpull or OD
pushpull
D-2
F-4
F-3
D-7
IUR-IN#
D-5
IUR-OUT#
GPIO/DTR# (o)
GPIO/DSR# (i)
Figure 29: Typical Application Schematics
Summary of Contents for BlueMod+S50/AI
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