TDK-Lambda
3
4-2.
Recommended Soldering Condition
Recommended soldering temperature is as follows.
(1) Soldering dip : 260°C within 10 seconds
Pre-heat condition : 110°C 30~40 seconds
(2) Soldering iron : 350°C within 3 seconds
4-3.
Recommended Cleaning Condition
Recommended cleaning condition after soldering is as follows.
•
Cleaning solvent : IPA (isopropyl alcohol)
•
Cleaning Procedure : Use brush and dry the solvent completely
Note : For other cleaning methods, contact us.
4-4.
Heatsink Installation
1)
The power module is fixed to the heatsink by 4 position through the M3 mounting tapped holes provided on the baseplate. It is recommended that the sequence to screw the 4
screws is in a diagonally manner and the recommended torque is 5.5kgcm.
2)
Recommended hole diameter for heatsink = 3.5mm.
3)
Use thermal grease or thermal sheet in between heatsink and baseplate to minimize the contact thermal resistance. However, make sure that the thermal grease or sheet is evenly
applied and using no-warped heatsink in order to avoid any warpage on the baseplate.
4)
Recommended thermal sheet is as shown below. Cutting the corner of thermal sheet is NOT advisable.
Summary of Contents for PAH-S48 series
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